Nozzle Soldering Tip with Hot Gas Deflection for Uniform Heating
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Solution Overview
Problem
Existing soldering methods, such as contact soldering and hot air soldering, either cause damage to substrates due to temperature gradients or result in lengthy process times, which are economically undesirable.
Innovation Solution
A soldering tool with a nozzle-shaped soldering tip and a hot gas feed channel that transitions into exhaust openings, featuring contact surfaces matching the soldering object and allowing for thermal contact with low resistance, while deflecting the hot gas jet to evenly heat the substrate, thereby avoiding thermal tensions and reducing process times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If contact soldering is used to reduce process time, then productivity is improved, but temperature gradients cause substrate damage
Solution Approach 1:
The soldering tip is divided into multiple heating zones with independent temperature control, allowing different regions to be heated to different temperatures. This segmentation enables the soldering area to reach high temperatures quickly while surrounding areas are heated more gradually, preventing thermal shock and substrate damage while maintaining short process times
Solution Approach 2:
The patent implements localized heating zones on the soldering tip where each zone can be independently controlled. The soldering location receives intense localized heat for rapid heating, while adjacent areas receive progressively less heat, creating a temperature gradient that prevents substrate damage. This local quality control allows simultaneous achievement of fast soldering and substrate protection
2Object-affected harmful factors
If hot air soldering is used to avoid substrate damage, then substrate damage is prevented, but process time increases
Solution Approach 1:
The patent merges contact heating and hot air heating methods into a single soldering tip structure. The tip includes both direct contact heating elements and channels for hot air flow, combining the advantages of both methods: rapid heat transfer through contact and gentle uniform heating through hot air, achieving both speed and substrate protection
Solution Approach 2:
The soldering tip acts as an intermediary that mediates between the heat source and the substrate. It receives intense heat and distributes it in a controlled manner through its structure, preventing direct thermal shock to the substrate while maintaining efficient heat transfer. The tip material and structure serve as a buffer that protects the substrate from temperature spikes
3Stability of the object's composition
If hot air flow is used to heat the soldering environment, then uniform heating is achieved, but additional fixtures are required
Solution Approach 1:
The soldering tip structure itself provides the support and positioning functions that would otherwise require separate fixtures. The tip is designed to be self-supporting and self-positioning, eliminating the need for additional external fixtures to hold or position the substrate during the soldering process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables quick and reliable bonding of larger objects with uniform heat distribution, preventing substrate damage and reducing process times, as demonstrated by successful soldering of copper foils on composite safety glass.
Implementation Method 1
The soldering tip and a portion of the soldering environment are heatable
Implementation Method 2
hot gas exhaust openings... hot gas heats the soldering tip as well as a portion of the soldering environment
Data Source
AI summary
A soldering tool, comprising nozzle shaped soldering tip and a hot gas feed channel that runs in the soldering tip, wherein the hot gas feed channel includes openings that provide a hot gas exhaust, and wherein the soldering tip as well as a portion of a soldering environment is heatable by the hot gas, characterized in that the soldering tip includes one or plural contact surfaces that have a surface structure which corresponds to a surface structure of a soldering object so that the soldering object is thermally contactable by the soldering tip with a minimum heat resistance, wherein a hot gas jet that passes through the openings is forced to perform at least one directional reversal or directional deflection by placement of the soldering tip and contacting the soldering object.