Neutral Point Clamp Converter Diode Packaging for Thermal Management
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Solution Overview
Problem
Neutral point clamped (NPC) type three-level converters experience high temperature rise in semiconductor modules, which affects their performance and reliability.
Innovation Solution
The power conversion device incorporates specific configurations of switching elements and diodes, including shunt diodes connected in parallel to free-wheeling diodes, to distribute heat generation and reduce temperature rise by forming multiple free-wheeling paths and optimizing the layout of modules on a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If four semiconductor modules are electrically connected in series with two clamp diodes as one leg in an NPC type three-level converter, then the converter can achieve three-level voltage output, but the two semiconductor modules located inside experience high temperature rise
Solution Approach 1:
The invention divides the single package containing multiple diodes into separate packages. Specifically, the seventh diode is placed in a second package different from the first package (which contains the second diode), and the eighth diode is placed in either the second package or a third separate package. This segmentation allows better thermal management by distributing heat sources across multiple packages with independent thermal paths to the heat sink.
Solution Approach 2:
The invention introduces separate packages as intermediary structures between the diodes and the heat sink. These packages act as thermal mediators that facilitate heat transfer from the diodes to the heat sink, improving the thermal coupling and reducing the temperature rise in the internal semiconductor modules.
2Device complexity
If multiple diodes are accommodated in a single package, then the device structure is simplified, but heat dissipation performance deteriorates due to thermal interference between diodes
Solution Approach 1:
The invention segments the diode packaging by placing the seventh diode in a second package separate from the first package containing the second diode. The eighth diode is placed in either the second package or a third separate package. This segmentation creates independent thermal zones for each diode, allowing each diode to dissipate heat independently to the heat sink without thermal interference from other diodes, thereby improving overall heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat generation in critical semiconductor modules, maintaining the converter within a safe temperature range and enhancing operational reliability.
Implementation Method 1
a first heat sink which cools the first package, the second package, and the another package
Data Source
AI summary
A power conversion device includes first to fourth switching elements, and first to eighth diodes. The first to fourth diodes are electrically connected in inverse parallel to the first to fourth switching elements, respectively. The seventh diode is electrically connected in parallel to the second diode. The eighth diode is electrically connected in parallel to the third diode. The second diode is housed in a first package. The seventh diode is housed in a second package, which is different from the first package, and which does not include the switching elements. The eighth diode is housed in the second package, or alternatively, the eighth diode is housed in another package, which is different from the first package and the second package, and which does not include the switching elements.