Semiconductor Device for NPC Inverter Arms via External Wiring
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Solution Overview
Problem
The existing semiconductor devices for NPC type 3-level inverters require two different types of semiconductor devices for the upper and lower arms, leading to potential misassembly issues and increased manufacturing complexity due to the need for special surface color changes.
Innovation Solution
A semiconductor device design that includes first and second self-extinguishing elements connected in series, with a third diode insulated from these elements and diodes, allowing for various electrical connection configurations through external wiring, enabling the implementation of multiple circuit types using a single device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two different types of semiconductor devices are used for upper and lower arms, then the circuit functionality is achieved, but the risk of misassembly increases and manufacturing complexity increases
Solution Approach 1:
The patent applies universality by designing a single semiconductor device that can function in both upper arm and lower arm positions through configurable external wiring. The device includes self-arc-extinguishing elements, diodes, and a third diode that can be connected in different configurations externally, allowing one device type to replace two previously required device types. This reduces assembly complexity and eliminates misassembly risks while maintaining full circuit functionality.
2Reliability
If surface color change is used as a countermeasure, then misassembly is prevented, but manufacturing process complexity increases
Solution Approach 1:
The patent applies self-service by making the device inherently capable of being correctly assembled through its symmetric design and external wiring configuration. The device structure itself provides the means for correct assembly without requiring external identification markers like color changes. The third diode's insulation and external wiring setup allow the same device to serve both upper and lower arm functions, eliminating the need for additional manufacturing steps for color coding.
3Adaptability or versatility
If a third diode is insulated from all self-arc-extinguishing elements and diodes, then circuit versatility is achieved, but device structure complexity increases
Solution Approach 1:
The patent applies the extraction principle by isolating the third diode from the internal structure, making it electrically insulated from all self-arc-extinguishing elements and diodes within the device. This extracted third diode is then connected through external wiring, allowing flexible circuit configuration without complicating the internal device structure. The insulation enables the third diode to serve multiple circuit functions while keeping the internal architecture simple and manageable.
Data Source
AI summary
The present invention implements an equivalent circuit to a semiconductor device for an upper arm by electrically connecting a terminal for E1C2 and a terminal for K with the use of an external wiring in a semiconductor device. On the other hand, in a semiconductor device including a circuit having the same structure as the semiconductor device, an external wiring is used to electrically connect a terminal for A and a terminal for E1C2. Consequently, there is implemented an equivalent circuit to a semiconductor device for a lower arm which is of a different type from the semiconductor device for the upper arm.