Nutplate Bonding Fixture With Localized Heat Cure Control

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Solution Overview

Problem

The long curing time of adhesives used in bonded hardware, such as nutplates, in the aerospace industry is problematic as it delays aircraft maintenance and production, and traditional methods of accelerating curing pose safety hazards and risks of over-heating, especially in environments with flammable materials.

Innovation Solution

A system that applies localized heating through a nutplate engagement fixture with a heater and temperature control, ensuring efficient heat transfer to the adhesive bondline while minimizing heat exposure to the surrounding structure, using a rigid and elastomeric tube assembly to secure the nutplate and heater in place.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If supplemental heating is used to accelerate adhesive curing, then cure time is reduced, but temperature control becomes difficult and surrounding structure may be damaged

Engineering Contradiction:
Improvecure timeVSAvoidtemperature damage to surrounding structure
Core Design Contradiction:
Loss of timeVSObject-affected harmful factors

Solution Approach 1:

The patent applies localized heating through a heater positioned within the nutplate engagement fixture that directs heat specifically to the adhesive bondline area. This localized approach reduces cure time while preventing excessive temperature exposure to the surrounding aircraft structure, resolving the contradiction between accelerated curing and thermal damage prevention.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The nutplate engagement fixture serves as an intermediary device that facilitates controlled heat transfer to the adhesive bondline. The fixture includes a heater and temperature sensor that mediate the heating process, enabling precise temperature control during curing while protecting surrounding structures from thermal damage.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If traditional heating methods are used to accelerate curing, then cure rate increases, but safety hazards arise in environments with flammable materials

Engineering Contradiction:
Improvecure rateVSAvoidsafety hazards with flammable materials
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The heating system is localized to the specific bondline area through the nutplate engagement fixture, preventing widespread heat exposure that could ignite flammable materials in the aircraft environment. This localized approach maintains high cure rates while eliminating safety hazards associated with traditional heating methods.

Inventive Principle:
Principle #3Local quality

3Productivity

If high heat is applied to reduce cure time, then adhesive strength develops faster, but consistency of cure is compromised

Engineering Contradiction:
Improvecure speedVSAvoidcure consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system incorporates a temperature sensor within the nutplate engagement fixture that provides real-time feedback on the temperature at the bonding surface. This feedback enables the heater controller to maintain precise temperature control during curing, ensuring consistent adhesive properties while achieving rapid cure times.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The temperature sensor and heater controller act as intermediaries that mediate the heating process, ensuring that heat is applied at the correct rate and temperature to achieve consistent curing. This controlled approach maintains both speed and precision of the curing process.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the nutplate bonding time, enhances adhesive cure consistency, and ensures safety by controlling the temperature at the bondline, thereby increasing aircraft availability and production rates while preventing damage to the surrounding structure.

Implementation Method 1

applies localized heating through the body of the hardware and into the adhesive bondline

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one temperature sensor operable to measure the temperature of the bonding surface of the nutplate

Methodology Applied
Scientific EffectTemperature sensing: Thermocouple

Data Source

PatentUS11084230B1Bonded nutplate rapid cure system
Publication Date: 2021.08.10 KINETICURE LLC
  • US11084230B1 patent drawing
  • US11084230B1 patent drawing
  • US11084230B1 patent drawing

AI summary

Embodiments of systems and methods for positioning and bonding a nutplate to a substrate comprising at least one aperture, wherein the system includes a nutplate engagement fixture formed from a rigid tube and an elastomeric tube, a heater operable to deliver heat to a bonding surface of the nutplate, at least one temperature sensor operable to measure the temperature of the bonding surface of the nutplate, a temperature sensor retention fixture operable to position and secure the at least one temperature sensor to the nutplate, and a heater controller operable to control the output from the heater.