NV-Diamond Scintillator Beam Profiler for EUV and Soft X-Ray Imaging

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Solution Overview

Problem

Existing technologies face challenges in effectively characterizing the beam properties of extreme ultraviolet (EUV) and soft X-ray (SXR) radiations due to their strong absorption by air and the necessity for detection in a vacuum, leading to issues with sensitivity, spatial resolution, and durability in industrial and scientific applications.

Innovation Solution

A beam profiler utilizing a scintillator layer comprising fluorescent nitrogen-vacancy diamonds (FNVDs) with optimized thickness, surface roughness, and NV density, combined with an imaging system, to convert EUV/SXR radiation into visible light for high-resolution imaging, employing an electrospray deposition process for uniform layer formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional scintillator materials are used for EUV/SXR detection, then the detection can be performed in vacuum, but the spatial resolution and sensitivity are insufficient

Engineering Contradiction:
Improvespatial resolutionVSAvoiddetection sensitivity
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent changes the physical and chemical parameters of the scintillator material by using fluorescent nitrogen-vacancy diamonds with controlled NV center density (0.1 to 1000 ppm) and optimized layer thickness (1 to 100 μm). This parameter optimization enables simultaneous achievement of high spatial resolution and sensitivity for EUV/SXR detection.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite scintillator layer comprising fluorescent nitrogen-vacancy diamonds embedded in a matrix material. This composite structure combines the high radiation hardness and photostability of diamond with the fluorescent properties of NV centers, achieving both high spatial resolution and detection sensitivity.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the scintillator layer thickness is increased to improve detection sensitivity, then the conversion efficiency increases, but the spatial resolution deteriorates

Engineering Contradiction:
ImproveUV-to-visible conversion efficiencyVSAvoidspatial resolution
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent optimizes the scintillator layer thickness parameter to a specific range (1 to 100 μm) that balances UV-to-visible conversion efficiency and spatial resolution. Additionally, controlling the NV center density (0.1 to 1000 ppm) ensures optimal fluorescence emission without excessive light absorption, resolving the contradiction between conversion efficiency and spatial resolution.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If conventional deposition methods are used, then the manufacturing process is simple, but the layer uniformity and surface quality are insufficient

Engineering Contradiction:
Improvelayer uniformityVSAvoiddeposition process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces conventional mechanical deposition methods with electrospray deposition, an electrohydrodynamic process that uses electric fields to generate charged droplets. This substitution enables precise control over layer thickness and uniformity while maintaining relatively simple manufacturing processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent optimizes electrospray deposition parameters including voltage (1-10 kV), flow rate (10-100 μL/min), and substrate distance (5-50 cm) to achieve uniform layer thickness and high surface quality. These parameter controls ensure consistent scintillator layer formation across large areas.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If the scintillator layer is made thicker to improve signal strength, then the detection sensitivity increases, but the fluorescence decay time increases and light afterglow increases

Engineering Contradiction:
Improvedetection sensitivityVSAvoidfluorescence decay time
Core Design Contradiction:
ReliabilityVSDuration of action of moving object

Solution Approach 1:

The patent controls the scintillator layer thickness (1 to 100 μm) and NV center density (0.1 to 1000 ppm) to optimize the balance between signal strength and fluorescence decay characteristics. This parameter optimization ensures fast fluorescence decay and minimal light afterglow while maintaining high detection sensitivity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The beam profiler achieves high UV-to-visible conversion efficiency, short fluorescence decay time, and low light afterglow, ensuring superior sensitivity, spatial resolution, and durability for precise EUV/SXR detection and monitoring, suitable for scientific research and industrial processes.

Implementation Method 1

The scintillator layer comprises one or more fluorescent nitrogen-vacancy diamonds and has a density of about 1 to 3.5 g/cm3

Methodology Applied
Scientific EffectFluorescence: Fluorescence

Implementation Method 2

a scintillator layer disposed over the substrate. The scintillator layer comprises one or more fluorescent nitrogen-vacancy diamonds

Methodology Applied
Scientific EffectScintillation: Scintillation

Implementation Method 3

producing charged droplets comprising the fluorescent nitrogen-vacancy diamond particles from the dispersion, and depositing the charged droplets over the substrate

Methodology Applied
Scientific EffectElectrospray deposition: Electrohydrodynamics

Data Source

PatentUS20260079272A1Extreme ultraviolet or soft x-ray radiation beam profiler
Publication Date: 2026.03.19 ACAD SINICA
  • US20260079272A1 patent drawing
  • US20260079272A1 patent drawing
  • US20260079272A1 patent drawing

AI summary

The present disclosure provides a beam profiler for extreme ultraviolet (EUV) or soft X-ray (SXR) radiation, comprising a scintillator and an imaging system configured to capture a fluorescence image generated by the scintillator. The scintillator includes a substrate and a scintillator layer disposed over the substrate. The scintillator layer comprises one or more fluorescent nitrogen-vacancy diamonds and has a density of about 1 to 3.5 g/cm3. This innovative design enables precise measurement and profiling of EUV or SXR radiation, offering high sensitivity and spatial resolution for various applications in scientific research and industrial processes.