NVDIMM Battery Mounting on Opposite Substrate Surface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Server computer systems with NVDIMMs require additional batteries on the main system board, which occupy space and increase volume, as batteries with super capacitor structures are sensitive to heat and cannot be efficiently integrated with existing memory modules.
Innovation Solution
A memory module design where batteries with a super capacitor structure are mounted on a surface opposite to the memory and controller components, using insulation members to prevent heat interference, allowing the module to self-sustain power during failures without additional external batteries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If batteries are mounted on the main system board to power NVDIMMs during power failure, then power backup capability is improved, but the volume and space occupation of the system increases
Solution Approach 1:
The patent combines the battery and super capacitor into a single integrated power backup component that is mounted directly on the NVDIMM module. This merging eliminates the need for separate batteries on the main system board, providing power backup capability while reducing overall system volume.
Solution Approach 2:
The super capacitor is positioned within the NVDIMM module structure, nesting the power backup components within the existing memory module footprint. This allows the battery and super capacitor to be housed together without requiring additional external space on the main system board.
2Area of stationary object
If batteries with super capacitor structure are integrated with memory modules, then space usage on main system board is reduced, but heat interference may affect component reliability
Solution Approach 1:
The NVDIMM module is divided into distinct functional regions: one surface for memory components (DRAMs, Flash Memories, controller) and the opposite surface for power backup components (battery, super capacitor). This segmentation physically separates heat-generating memory components from heat-sensitive battery components, reducing thermal interference while maintaining compact form factor.
Solution Approach 2:
The patent introduces a heat dissipation structure that acts as an intermediary between the memory components and the battery. This heat dissipation structure absorbs and conducts away heat from the memory components, preventing it from reaching the heat-sensitive battery and super capacitor components.
Data Source
AI summary
A memory module may include a module substrate having first and second surfaces facing away from each other, a plurality of first memories mounted over one or more of the first and second surfaces, one or more second memories and a controller each mounted over one of the first and second surfaces of the module substrate, and a plurality of batteries mounted over one or more of the first and second surfaces of the module substrate.