Nylon Blend Packaging Films Heat Shrink Balance

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Solution Overview

Problem

Existing heat shrinkable food packaging films face challenges in achieving a balance between heat resistance and heat shrink characteristics, as the addition of heat-resistant materials can reduce the overall free shrink of the package films, making it difficult to simultaneously seal multiple packages without them adhering to each other.

Innovation Solution

A blend of an amorphous nylon copolymer, a low temperature polyamide, and a high temperature polyamide is used to create packaging films that are biaxially oriented and heat-shrinkable, with a total free shrink of at least 30% in one direction and up to 100% in another, ensuring adequate heat resistance while maintaining desirable shrink characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat-resistant materials are added to packaging films, then heat resistance is improved, but free shrink is reduced

Engineering Contradiction:
Improveheat resistanceVSAvoidfree shrink
Core Design Contradiction:
TemperatureVSLength of moving object

Solution Approach 1:

The patent uses a composite material system consisting of three distinct polyamide layers with different thermal properties. The first layer (lower melting point polyamide) provides heat shrinkability, the second layer (intermediate melting point polyamide) provides barrier properties, and the third layer (higher melting point polyamide) provides heat resistance. This composite structure allows the film to simultaneously achieve high heat resistance and adequate free shrink by combining materials with complementary properties rather than relying on a single material.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The packaging film is divided into three separate functional layers, each with a specific melting point range and property profile. The segmentation allows each layer to perform its specialized function independently: the first layer melts at lower temperatures to enable shrink wrapping, the second layer provides oxygen and moisture barrier properties, and the third layer maintains structural integrity at high temperatures. This segmentation resolves the contradiction by distributing thermal functions across multiple specialized components.

Inventive Principle:
Principle #1Segmentation

2Temperature

If heat-resistant materials are added to packaging films, then heat resistance is improved, but ability to seal multiple packages without adhesion is worsened

Engineering Contradiction:
Improveheat resistanceVSAvoidsealing capability
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The composite three-layer structure enables differentiated thermal responses: the first layer with lower melting point (180-220°C) softens at sealing temperatures to allow packages to be heat sealed together, while the third layer with higher melting point (220-260°C) remains rigid and prevents adhesion between stacked packages during the sealing process. This composite approach allows the film to exhibit both sealability and non-adhesion properties simultaneously through its multi-layer architecture.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

Different regions of the film (different layers) have different thermal properties tailored to specific functions. The outer surfaces that contact adjacent packages during sealing have lower melting point material for easy sealing, while the inner structural layers have higher melting point material to prevent unwanted adhesion. This local differentiation of material properties resolves the contradiction between sealability and non-adhesion.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides packaging films with enhanced heat resistance and heat shrinkability, allowing for efficient sealing of multiple packages without adhesion issues, while maintaining the desired level of free shrink, thus addressing the need for films that can withstand high temperatures and retain product freshness.

Implementation Method 1

heat shrinkable films... have a total free shrink measured at 90° C. of at least 30%... biaxially oriented and heat-shrinkable

Methodology Applied
Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentUS8741433B2Packaging films comprising nylon blend compositions
Publication Date: 2014.06.03 BEMIS COMPANY INC
  • US8741433B2 patent drawing
  • US8741433B2 patent drawing
  • US8741433B2 patent drawing

AI summary

Compositions and packaging films are provided having a blend of an amorphous nylon copolymer, a low temperature polyamide, and a high temperature polyamide. The compositions can be used in making heat shrinkable films and food packages having desirable levels of free shrink.