Compressed O-Ring Sealing for Accurate Electrochemical Fluid Sensing
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Solution Overview
Problem
Commonly used fluid sensing packages face issues with seal adhesion, mechanical robustness, chemical inertness, and ion absorption, leading to inaccurate measurements and increased costs due to non-standard manufacturing techniques.
Innovation Solution
The use of a chemically inert o-ring seal compressed by a chemically inert member, such as PEEK or PTFE, which circumscribes the electrochemical sensor, providing a robust and accurate seal that prevents ion absorption and withstands temperature fluctuations, integrated with wirebond or flip-chip connections for cost-effectiveness and compatibility with existing technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If common seal materials are used in fluid sensing packages, then manufacturing cost is reduced, but the seal absorbs ions leading to measurement inaccuracies
Solution Approach 1:
The patent applies this principle by selecting seal materials (such as PTFE, PEEK, or other chemically inert polymers) that are chemically inert and do not absorb ions from the fluid being measured. This inert material choice eliminates the harmful ion absorption effect while maintaining sealing functionality, thereby preserving measurement accuracy.
Solution Approach 2:
The patent employs composite material structures where the seal is made from chemically inert materials that combine sealing properties with chemical resistance. These composite materials provide both the mechanical sealing function and the chemical inertness required to prevent ion absorption, resolving the contradiction between measurement precision and ion absorption.
2Reliability
If non-standard manufacturing techniques are used to improve seal performance, then seal reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies this principle by designing a seal structure that serves multiple functions: it provides mechanical sealing, chemical resistance, and structural support simultaneously. The chemically inert member integrates these functions into a single component that can be manufactured using standard techniques, avoiding the need for complex non-standard manufacturing processes while maintaining high reliability.
Solution Approach 2:
The seal design allows the chemically inert member to self-align and self-seal through its inherent mechanical properties. The compression mechanism and geometric design enable the seal to automatically position itself and create the sealing interface without requiring precision alignment or complex assembly procedures, thereby reducing manufacturing costs while maintaining reliability.
3Reliability
If the seal is compressed to improve sealing effectiveness, then sealing performance is improved, but the seal material degrades due to chemical exposure
Solution Approach 1:
The patent applies this principle by selecting seal materials such as PTFE, PEEK, or other chemically inert polymers that resist degradation from chemical exposure. These materials maintain their mechanical properties and structural integrity even when compressed and exposed to harsh chemicals, thereby achieving both effective sealing and material stability.
Solution Approach 2:
The patent employs parameter changes by selecting materials with specific chemical resistance properties and mechanical characteristics. The chemically inert materials are chosen based on their ability to maintain compositional stability under compression and chemical exposure, with parameters such as chemical resistance, compressive strength, and elasticity optimized to achieve both sealing effectiveness and material stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a reliable, accurate, and cost-effective fluid sensing package that maintains measurement integrity across varying conditions and is compatible with diverse applications, including home appliances, medical devices, and industrial settings.
Implementation Method 1
a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die
Data Source
AI summary
In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.