OBD Connector PCB Assembly for Accurate Pin Alignment
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Solution Overview
Problem
Existing On-Board Diagnostics (OBD) devices face challenges in efficiently utilizing space and maintaining pin alignment, leading to stress on pins and potential failure due to misalignment and the use of pin headers, which are bulky and require through-hole assembly, making them costly and inefficient.
Innovation Solution
The solution involves using two PCB assemblies with pin carriers to retain rows of parallel pins, eliminating the need for pin headers and allowing for accurate alignment and reduced stress on pins, enabling efficient use of space and robust pin connections through surface mount technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pin headers are used to retain rows of pins, then pin alignment can be maintained, but the device becomes bulky and requires through-hole assembly which increases cost and complexity
Solution Approach 1:
The patent removes the pin header component entirely from the design. Instead of using a separate pin header to retain the pins, the pins are directly retained by the PCB assembly itself through surface mount technology, eliminating the need for through-hole assembly and reducing device complexity while maintaining pin alignment precision
Solution Approach 2:
The patent replaces the mechanical through-hole assembly system with a surface mount system. The pins are mounted on the surface of the PCB and retained through soldering and structural features of the PCB assembly, eliminating the need for mechanical pin headers and through-hole fastening mechanisms
2Strength
If pin headers are used to retain pins, then pins can be held in place, but the device size increases and space efficiency decreases
Solution Approach 1:
The patent merges the pin retention function into the PCB assembly itself. The PCB structure is designed to directly retain the pins through surface mount features, eliminating the need for separate pin header components. This integration reduces the overall device volume while maintaining adequate pin retention strength through the combined PCB-pin structure
3Reliability
If through-hole assembly is used for pin headers, then robust connections can be achieved, but manufacturing cost and time increase
Solution Approach 1:
The patent replaces the through-hole assembly process with surface mount technology. The pins are mounted on the PCB surface and connected through soldering, which is a more efficient and automated process compared to through-hole assembly. This substitution maintains connection reliability through proper solder joint design while significantly improving manufacturing productivity and reducing costs
4Ease of manufacture
If pins are poorly aligned, then device can be manufactured simpler, but pin stress increases and failure risk increases
Solution Approach 1:
The patent removes the pin header component that complicated the manufacturing process. By directly mounting pins on the PCB surface without requiring separate alignment fixtures or header components, the design achieves both manufacturing simplicity and pin alignment precision, thereby maintaining pin reliability while ease of manufacture
Data Source
Figure 1~2A
Figure 2B~3
Figure 4A~4B
AI summary
An On-Board Diagnostics (OBD) device (100) is configured to be connected to an OBD port of a vehicle in use. The OBD device (100) comprises a first PCB assembly (110) and a second PCB assembly (120). Each one of the first and second PCB assemblies (110,120) comprises a PCB (112,122) and a pin assembly (114,124). The pin assembly (114,124) comprises a pin carrier (116,126) and a row of parallel pins (118,128) retained by the pin carrier (116,126). Each pin of the row of pins (118,128) comprises a proximal portion (402) extending from one side of the pin carrier, at least a proximal end of the pin being connected to the PCB (112,122), and a distal portion (406) extending from an opposite side of the pin carrier (116,126) for providing a pin contact of the device (100), wherein the row of parallel pins (118,128) retained by the pin carrier (116,126) provides a row of parallel pin contacts (810,820). The first and second PCB assemblies (110,120) are located relative to one another such that the rows of parallel pin contacts (810,820) provided by the first and second PCB assemblies (110,120) respectively provide respective ones of rows of parallel pin contacts (810,820) of a connector of the OBD device (100), the pin contacts (810,820) being arranged so as to be receivable by openings of an OBD port when the OBD device (100) is connected to an OBD port of a vehicle.