Object Preparation Device for Particle Beam Analysis
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Solution Overview
Problem
Existing microtomes in particle beam apparatuses face challenges with contamination of exposed areas, inaccurate positioning due to heat expansion, and contamination from residual materials during layer removal, which affects imaging quality and precision.
Innovation Solution
The object preparation device features a cutting device with a bevel for precise layer removal, a movably embodied object receptacle, and a drive unit for controlled movement, ensuring the cutting bevel is closer to the observation axis to prevent contamination, using low heat output motors for precise positioning, and a base unit for maintaining constant working distance and layer thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a microtome is used to remove layers of the object, then the object can be prepared for examination, but the exposed area may be contaminated by residual material from the cutting bevel
Solution Approach 1:
The patent extracts and removes residual material from the cutting bevel surface before it can contaminate the exposed area. The residual material is actively taken out of the system through cleaning mechanisms, preventing contamination of the freshly cut surface.
Solution Approach 2:
The patent performs preliminary cleaning of the cutting bevel before cutting operations to prevent contamination. By cleaning the bevel surface in advance, residual material that would otherwise contaminate the exposed area is removed beforehand, ensuring a clean cutting surface.
2Speed
If motors with high power are used to position the object receptacle, then positioning speed is improved, but heat expansion causes positioning inaccuracies
Solution Approach 1:
The patent changes the power parameter of the motors from high to low, accepting slower positioning speed in exchange for minimal heat generation. This parameter change eliminates thermal expansion issues and maintains positioning accuracy throughout the operation.
Solution Approach 2:
The patent converts the potential harm of slow positioning into a benefit by using low-power motors that generate minimal heat. The slow positioning speed becomes acceptable because it eliminates the more critical issue of heat-induced positioning inaccuracies, ultimately improving overall system precision.
3Object-affected harmful factors
If the cutting bevel is positioned closer to the observation axis, then contamination is prevented, but the device complexity increases
Solution Approach 1:
The patent merges the cutting bevel position with the observation axis by aligning them closely. This spatial merging allows the cutting operation to occur near the observation axis without requiring separate complex positioning systems, preventing contamination while maintaining relatively simple device architecture.
4Object-affected harmful factors
If the object receptacle is moved during cutting operation, then contamination can occur, but stopping the movement reduces productivity
Solution Approach 1:
The patent performs preliminary cleaning of the cutting bevel before the cutting operation begins. This preliminary action ensures that no residual material is present to contaminate the exposed area, allowing the object receptacle to move continuously during cutting without stopping, thereby maintaining high productivity.
Solution Approach 2:
The cutting bevel is designed to self-clean or be easily cleaned between operations. This self-service capability ensures that residual material is removed automatically or with minimal intervention, preventing contamination while allowing continuous operation and maintaining productivity.
Data Source
AI summary
An object preparation device for preparing an object in a particle beam apparatus includes at least one cutting device, at least one cutting bevel for cutting the object, where the cutting bevel is arranged at the cutting device, at least one movably embodied object receptacle device having an object receptacle for receiving the object, and at least one drive unit for moving the object receptacle device from a first position of the object receptacle device into a second position of the object receptacle device. The first position of the object receptacle device is an initial position. The second position of the object receptacle device is an analysis and/or processing position of the object receptacle device. An observation axis (OA) extends through the object receptacle when the object receptacle device is arranged at the second position.