Object Table High-Voltage Wiring for Low-Field Precision Positioning

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Solution Overview

Problem

In semiconductor processes, high voltage electrical connections used for electron beam applications create conflicts between minimizing electric field intensity and mechanical stiffness, affecting the accuracy and positioning of object tables in tools like SEMs and e-beam inspection systems.

Innovation Solution

The development of an innovative electrical connection that arranges wires in a spatial configuration to produce an equivalent electric field with a larger diameter, reducing maximal electric field intensity while maintaining low mechanical stiffness, achieved through arrangements such as coils, multiple parallel wires, and virtual enveloping volumes with voids.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thick wire is used to provide high voltage, then the electrical connection is more robust, but the mechanical stiffness increases and disturbs accurate positioning of the object table

Engineering Contradiction:
Improveelectrical connection robustnessVSAvoidmechanical stiffness
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The electrical connection is segmented into multiple thin wires or strands instead of using a single thick wire. This segmentation maintains the electrical conductivity and robustness while significantly reducing the mechanical stiffness, allowing the object table to be positioned accurately without disturbance from the electrical connection.

Inventive Principle:
Principle #1Segmentation

2Reliability

If high voltage is applied through a thick wire, then the electrical connection is stable, but the electric field intensity increases and causes harmful effects

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidelectric field intensity
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Dividing the electrical connection into multiple thin wires reduces the electric field intensity at each wire surface while maintaining the overall voltage application capability. This segmentation lowers the harmful electric field effects on the electron beam and specimen while preserving electrical connection stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The electrical connection is arranged in a spatial configuration where multiple wires are distributed in different positions and orientations. This dimensional arrangement spreads out the electric field distribution, reducing the peak electric field intensity at any single location while maintaining the overall electrical function.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces electric field intensity while minimizing mechanical stiffness, enhancing the precision and stability of object table positioning in electron beam applications, thereby improving semiconductor process yield and reducing defects.

Implementation Method 1

The electrical connection is configured to produce, in use, an electric field, which is partly determined by an equivalent electrical diameter which is defined by the spatial arrangement of the one or more wires

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 2

an electrical connection configured to electrically connect the electrode to the power source, wherein the electrical connection comprises one or more coils, or one or more wires arranged on a circular circumference

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11996263B2Stage apparatus
Publication Date: 2024.05.28 ASML NETHERLANDS BV
  • US11996263B2 patent drawing
  • US11996263B2 patent drawing
  • US11996263B2 patent drawing

AI summary

The present disclosure relates to a stage apparatus comprising: an object table configured to hold a substrate, the object table comprising an electrode configured to be charged by a power source and an electrical connection configured to electrically connect the electrode to the power source, and an electric field shield configured to shield at least a part of the electrical connection.