Objective Carrier Assembly With Contamination-Proof Sensor Alignment
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Solution Overview
Problem
Existing methods for manufacturing automotive cameras fail to achieve the required precision and cleanliness in optical alignment, particularly for augmented reality applications, where accuracy below +/-1 degree for pitch, yaw, and roll angles is critical, and are hindered by high costs and extended process times due to complex assembly processes and cleanliness requirements.
Innovation Solution
A method for manufacturing an objective carrier assembly where the camera objective is mounted on a carrier with a contamination-proof space, allowing for precise alignment and reduced mechanical stresses, using a carrier with a printed circuit board and optical components, and aligning the objective carrier assembly relative to the camera housing using geometrical features and live measurement data to achieve accurate pitch, yaw, and roll angle alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the camera objective is aligned with respect to a carrier based on housing features, then alignment can be achieved, but manufacturing costs increase and manufacturing precision deteriorates
Solution Approach 1:
The patent extracts the alignment function from the housing features and relocates it to the carrier. The carrier is equipped with specific geometric features (such as positioning elements or reference marks) that enable precise alignment of the camera objective with the sensor, independent of the housing. This extraction allows the housing to be manufactured with standard tolerances while maintaining high alignment precision through the carrier's dedicated alignment features.
Solution Approach 2:
The alignment features are pre-integrated into the carrier during its manufacturing process, before the final assembly with the housing and sensor. This preliminary preparation of alignment references on the carrier enables subsequent precise positioning operations without requiring complex housing features or post-assembly adjustments, thereby reducing overall manufacturing costs while maintaining precision.
2Manufacturing precision
If high cleanliness levels are maintained for all components, then optical precision is improved, but process time increases and device complexity increases
Solution Approach 1:
The patent segments the camera system into distinct functional modules: the sensor carrier assembly and the housing assembly. The carrier with the sensor and objective is prepared and aligned as a separate unit with controlled cleanliness requirements. This segmentation allows the housing to be assembled with standard cleanliness levels, while only the critical optical path components (sensor and objective on the carrier) require high cleanliness, thereby reducing overall process time and complexity.
Solution Approach 2:
The patent applies different cleanliness requirements to different parts of the system. High cleanliness standards are applied locally only to the optical path components (sensor surface, objective lens, and carrier mounting areas), while other components such as the housing and non-optical structures can be manufactured with standard cleanliness levels. This localized quality approach maintains optical precision while significantly reducing the time and complexity associated with maintaining high cleanliness throughout the entire device.
3Ease of manufacture
If the camera sensor is exposed during assembly, then assembly process is simplified, but contamination risk increases and reliability deteriorates
Solution Approach 1:
The patent implements a nested structure where the sensor is mounted on the carrier, and the objective is subsequently mounted on the carrier over the sensor. The carrier serves as a protective carrier that holds the sensor in a controlled environment during assembly. The objective housing then encloses the sensor and optical components, creating a nested protective structure that prevents contamination while maintaining assembly simplicity. The sensor is never fully exposed to the external environment during the assembly process.
Solution Approach 2:
The carrier acts as an intermediary component between the sensor and the external environment. It provides a controlled mounting surface for the sensor and serves as the base for mounting the objective. This intermediary carrier structure allows the sensor to be positioned and aligned precisely while protecting it from contamination during the assembly process, and then the objective housing provides a second layer of protection, eliminating the need for complex contamination control procedures.
Data Source
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AI summary
The invention relates to a method for manufacturing an objective carrier assembly comprising the steps: mounting a camera objective comprising at least one lens and an objective housing on a carrier comprising at least one camera sensor, wherein a contamination proof space is formed between the carrier and the objective housing, wherein boundaries of the contamination proof space are at least partially formed by portions of the carrier, the objective housing, and at least one optical component of the camera objective, and wherein the camera sensor is enclosed in said contamination proof space. The invention furthermore relates to an objective carrier assembly for a camera a method for manufacturing a camera and a camera.