Oblique Bonding Area for Narrow Bezel Display Panel
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Solution Overview
Problem
The existing chip-on-glass (COG) panel technology faces challenges in achieving an extremely narrow bezel design due to the large occupied space by the fan-out wiring area and the driver chip bonding area in the lower bezel of the display panel.
Innovation Solution
The solution involves a display panel design with oblique bonding areas that overlap with the fan-out area, allowing for a reduction in the overall height of the fan-out and bonding areas. This design includes a first oblique bonding area with a stepped-shape arrangement of bonding terminal groups, which optimizes space utilization and reduces signal wire impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of signal wires is increased to meet higher resolution requirements, then the display resolution is improved, but the height of the fan-out area increases making it difficult to compress
Solution Approach 1:
The bonding area transitions from a traditional horizontal arrangement to an oblique arrangement relative to the fan-out wires. This dimensional change allows the bonding area to overlap with the fan-out area, effectively reducing the overall height occupied by these components while maintaining all necessary signal connections for high resolution displays
2Measurement precision
If the fan-out area and driver chip bonding area are enlarged to accommodate more signal wires, then the display resolution is improved, but the lower bezel height increases
Solution Approach 1:
The bonding area and fan-out area are merged through oblique arrangement, allowing them to overlap spatially. This combination eliminates the need for separate non-overlapping regions, thereby reducing the total height of the lower bezel while maintaining the capacity for high-resolution signal transmission
3Ease of manufacture
If the bonding area is arranged horizontally to simplify wiring, then the ease of manufacture is improved, but the height of the lower bezel increases
Solution Approach 1:
The bonding area is arranged obliquely rather than horizontally, creating an asymmetric configuration relative to the fan-out wires. This asymmetric oblique arrangement allows the bonding terminals to be positioned more efficiently, reducing the overall height while maintaining manufacturability through standardized bonding processes
Data Source
AI summary
A display panel, display device, and driver chip are provided. A non-display area of the display panel comprises a bonding area comprising a first bonding area. The first bonding area comprises a horizontal bonding area and a first oblique bonding area comprising a first end and a second end. A distance from the second end to the display area is greater than a distance from the first end to the display area of the display panel. A plurality of bonding terminal groups of the first oblique bonding area are arranged in a stepped-shape manner at equal intervals or unequal intervals.