Oblique Circuit Board Backlight Module for Display Devices
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Solution Overview
Problem
The existing backlight modules suffer from a short light source mixing distance and a small bonding area between the circuit board and the sealant, which affects the optical performance and reliability of the display device.
Innovation Solution
The backlight module design includes a back plate with a sealant having an inclined surface, a light guide plate, and a circuit board with a light source positioned between the sealant and the light guide plate, where the circuit board is obliquely disposed to increase the bonding area and reduce the light mixing distance, utilizing a reflective and diffusion layer for enhanced light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the distance between the light emitting area of the backlight module and the light emitting surface of the light source is reduced, then the screen area ratio is improved, but the optical performance deteriorates due to insufficient light mixing distance
Solution Approach 1:
The circuit board is rotated from a horizontal arrangement to an oblique arrangement, changing the spatial dimension and orientation of component placement. This allows the light source to be positioned closer to the light emitting area while maintaining sufficient light mixing distance through the inclined configuration, thereby improving screen area ratio without compromising optical performance
Solution Approach 2:
The circuit board is arranged obliquely rather than horizontally, creating an asymmetric layout. This asymmetric positioning enables optimized spatial relationship between the light source and light emitting area, allowing reduced distance while maintaining adequate light mixing path, thus resolving the contradiction between screen area ratio and optical performance
2Ease of manufacture
If the circuit board is positioned horizontally to simplify assembly, then the manufacturing process is easier, but the bonding area between the circuit board and sealant is reduced, causing separation issues
Solution Approach 1:
The circuit board transitions from horizontal to oblique positioning, creating an asymmetric arrangement that increases the bonding contact area between the circuit board and sealant. This oblique configuration provides better mechanical interlocking and larger adhesive surface, preventing separation while remaining compatible with manufacturing processes
Solution Approach 2:
The sealant layer is designed with an inclined surface that matches the oblique angle of the circuit board, creating a curved/angled bonding interface rather than a flat horizontal one. This inclined surface geometry increases the effective bonding area and improves adhesion strength, preventing circuit board separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the light emitting area ratio and bonding strength, enhancing the optical performance and reliability of the backlight module by increasing the light mixing distance and bonding area, thereby improving the display's visual effect.
Implementation Method 1
one side of the circuit board is bonded to the upper surface of the sealant
Implementation Method 2
the backlight module further includes a reflective layer disposed between the light guide plate and the back plate
Implementation Method 3
the reflective layer includes a reflective region and a diffusion region for enhancing light diffusion
Implementation Method 4
The backlight module is a light source fixed to the rear of the liquid crystal display
Data Source
AI summary
Provided are a backlight module and a display device. The backlight module includes a back plate, a sealant and a light source portion. The sealant includes a first surface with an inclined angle. The light source portion includes a circuit board and a light source. A first end of the circuit board is disposed on the first surface, and a second end of the circuit board is disposed on the light guide plate. The circuit board is obliquely disposed on the sealant and the light guide plate.