Oblique-Viewing Endoscope Imaging Unit Segmentation
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Solution Overview
Problem
Oblique-viewing endoscopes face challenges in efficiently integrating imaging units with oblique optical axes and flexible circuit boards, leading to increased complexity and potential noise issues due to thermal expansion differences and impedance increases.
Innovation Solution
The proposed imaging unit features a semiconductor package with a perpendicularly arranged light receiving surface, a first circuit board connected to the sensor electrode, and a second circuit board with a flexible design that forms an obtuse angle to accommodate cable connections, reducing noise and heat-related issues while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the flexible printed board is bent to connect the imaging device terminal, then the oblique optical axis can be accommodated, but the cable connecting electrode position becomes difficult to control and impedance increases
Solution Approach 1:
The circuit board connection is divided into two separate boards: a rigid circuit board for stable electrode positioning and a flexible printed board for cable connection. This segmentation allows each board to optimize its function - the rigid board maintains precise electrode positions while the flexible board provides adaptability for cable routing, thereby resolving the contradiction between adaptability and connection complexity.
Solution Approach 2:
The rigid circuit board acts as an intermediary between the imaging device and the flexible printed board. It receives signals from the imaging device and provides stable connection points (electrodes) while the flexible board handles the cable connection. This intermediary structure eliminates the need to bend the flexible board to achieve precise electrode positioning, reducing impedance and simplifying the overall connection.
2Ease of manufacture
If electronic parts are mounted on the flexible printed board, then integration is achieved, but noise increases due to thermal expansion differences
Solution Approach 1:
Electronic parts are segregated onto a separate rigid circuit board rather than being mounted on the flexible printed board. This segmentation prevents the flexible board from experiencing thermal stress from mounted components, eliminating noise generation from thermal expansion differences while maintaining full integration of electronic parts on the rigid board where thermal stability is achieved.
Solution Approach 2:
The rigid circuit board provides a homogeneous, thermally stable substrate for mounting electronic parts. Unlike the flexible printed board which has varying thermal properties due to its flexibility and composition, the rigid board offers uniform thermal characteristics that minimize expansion differences and noise, while still achieving complete integration of all electronic components.
3Measurement precision
If the light receiving surface is arranged perpendicularly to the optical axis, then image quality is improved, but the structure becomes more complex
Solution Approach 1:
The perpendicular arrangement of the light receiving surface to the optical axis is achieved by combining the imaging device mounting orientation with the rigid circuit board orientation. The rigid board is positioned perpendicular to the optical axis, and the imaging device is mounted on it with its light receiving surface also perpendicular to the optical axis. This merging of orientations achieves optimal image quality while the modular rigid board structure keeps the overall device complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances image quality by reducing noise and heat-related problems, facilitates easier assembly, and maintains a compact design for the oblique-viewing endoscope, making it more efficient and cost-effective.
Implementation Method 1
an imaging device configured to convert an optical image formed by the lens unit into an image signal
Data Source
AI summary
An imaging unit used in an oblique-viewing endoscope in which an endoscope axis along a longitudinal direction of a distal end portion of the endoscope and an optical axis of a lens unit cross along an observation direction includes: a semiconductor package including a light receiving surface arranged perpendicularly to the optical axis of the lens unit, an imaging device converting an optical image formed by the lens unit into an image signal, and a sensor electrode on a rear surface; a first circuit board including a first connecting electrode on a front surface and connected to the sensor electrode, and a second connecting electrode on a rear surface on which an electronic part is mounted; and a second circuit board including a first region including a third connecting electrode connected to the second connecting electrode, and a second region including a cable connecting electrode connected to a cable.