Oblique Hole Ceramic Coating for Plasma Particle Control
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Solution Overview
Problem
Semiconductor manufacturing apparatus members that contact plasma and have holes tend to produce particles, which reduce the yield and productivity of semiconductor devices due to plasma corrosion, and existing coatings may not sufficiently address this issue, especially in high-density plasma environments.
Innovation Solution
A semiconductor manufacturing apparatus member with a ceramic layer on a base material, featuring oblique holes with specific surface configurations, where the ceramic layer provides enhanced plasma corrosion resistance, and the base material directly contacts plasma at certain areas to minimize particle production, while maintaining structural integrity and reducing electric field concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic layer is applied to the entire hole surface, then plasma corrosion resistance is improved, but particle production increases due to ceramic layer degradation
Solution Approach 1:
The patent applies different surface treatments to different parts of the hole: the first hole part (continuous with the first surface) is coated with ceramic layer to provide plasma corrosion resistance, while the third hole part (oblique and exposed) is left without ceramic coating to prevent particle production. This local differentiation resolves the contradiction by providing protection only where needed.
2Reliability
If the ceramic layer is made thicker, then plasma corrosion resistance is improved, but the risk of ceramic layer degradation and particle production increases
Solution Approach 1:
The patent varies the thickness and presence of ceramic layer across different hole parts: the first hole part has ceramic coating for protection, while the third hole part is intentionally left exposed without ceramic layer. This prevents the ceramic layer from degrading in areas where it would produce particles, while maintaining adequate protection in areas requiring corrosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses particle production from the holes, enhances plasma resistance, and reduces the risk of ceramic layer degradation, thereby improving the yield and reliability of semiconductor devices.
Implementation Method 1
a plasma corrosion resistance of the ceramic layer is greater than a plasma corrosion resistance of the base material
Implementation Method 2
reduces electric field concentration
Data Source
AI summary
According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer located on the base material. The base material includes a first surface, a second surface, and at least one hole extending through the first and second surfaces. The at least one hole includes a first, a second and a third hole part. The first hole part is continuous with the first surface and is oblique. The second hole part is between the second surface and the first hole part. The third hole part is between the first hole part and the second hole part and is oblique. The ceramic layer includes a first part located on the first surface and a second part located on the first hole part.