Oblique ILB Electrodes for Flexible Display Panel DDIC Mounting
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Solution Overview
Problem
The compatibility issue between display panels and display driver integrated circuit (DDIC) chips, particularly due to the thermal expansion of plastic substrates used in flexible or foldable displays, makes it difficult to align bumps on DDIC chips with electrodes on the display panel, leading to increased costs as each panel is designed specifically for a particular DDIC chip configuration.
Innovation Solution
The use of inner lead bonding (ILB) electrodes with obliquely extended bonding segments on a plastic substrate display panel allows for the alignment and bonding of DDIC chips with different configurations, mitigating thermal expansion effects by providing adaptable bonding segments that can accommodate various DDIC chip layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are designed to match the layout of DDIC chip bumps, then electrical connection reliability is improved, but device adaptability deteriorates
Solution Approach 1:
The electrode is divided into multiple bonding segments (first bonding segment, second bonding segment, third bonding segment) with different orientations. Each bonding segment can independently bond to bumps on the DDIC chip, allowing the electrode structure to accommodate different bump layouts while maintaining reliable electrical connections.
Solution Approach 2:
The electrode structure with multiple bonding segments serves multiple functions: it can bond to DDIC chips with different bump configurations, accommodate thermal expansion differences, and maintain electrical connectivity. This multi-functional design enables a single electrode structure to work with various DDIC chip types, improving device adaptability.
2Adaptability or versatility
If plastic substrate is used for flexible display, then device flexibility is improved, but manufacturing precision deteriorates due to thermal expansion
Solution Approach 1:
The bonding segments are designed with different orientations (first direction, second direction, third direction) to dynamically adapt to thermal expansion effects during the bonding process. When thermal expansion occurs, the oblique bonding segments can still maintain contact with the bumps, allowing the structure to accommodate dimensional changes while preserving alignment precision.
Solution Approach 2:
The electrode structure changes its effective bonding parameters by utilizing multiple bonding segments with different orientations. This allows the system to adapt to parameter changes in the plastic substrate caused by thermal expansion, maintaining manufacturing precision despite the flexible substrate's dimensional instability.
3Adaptability or versatility
If oblique bonding segments are used, then device adaptability is improved, but device complexity increases
Solution Approach 1:
Multiple bonding segments with different orientations are merged into a single integrated electrode structure. This unified design achieves DDIC chip configuration compatibility through the combined action of all bonding segments, rather than requiring separate electrode structures for each configuration, thereby managing complexity through integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the use of a single display panel with multiple DDIC chip configurations, reducing production costs and improving the reliability of electrical connections by effectively managing thermal expansion during the mounting process.
Implementation Method 1
The compatibility issue between display panels and display driver integrated circuit (DDIC) chips, particularly due to the thermal expansion of plastic substrates used in flexible or foldable displays
Data Source
AI summary
A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first ILB electrode is configured to be bonded to an integrated circuit chip using one of the first bonding segment or the second bonding segment.