Oblique Interconnection Routing for Head Chip Reliability
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Solution Overview
Problem
Existing liquid jet recording devices face challenges in achieving miniaturization while maintaining reliability, particularly in the design of head chips and inkjet heads, where the connection area between interconnections and the interconnection board is limited by the need to circumvent obstacles and maintain efficient electrical connections.
Innovation Solution
The head chip incorporates a cover plate with interconnection connecting sections that include both bend and straight parts, allowing individual interconnections to extend obliquely and circumvent obstacles, increasing the connection area and reducing resistance, while also using alignment marks for precise alignment and capacitance measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interconnections are designed to circumvent obstacles by extending obliquely, then connection reliability is improved, but the connection area becomes more complex and harder to manufacture
Solution Approach 1:
The interconnection design transitions from a simple straight-line connection to an oblique extension that circumvents obstacles by utilizing additional spatial dimensions. This allows the interconnection to route around obstacles (such as through-holes or structural features) while maintaining electrical connectivity, thereby improving reliability without significantly complicating the manufacturing process.
2Volume of moving object
If the head chip size is reduced to achieve miniaturization, then device compactness is improved, but connection resistance increases
Solution Approach 1:
The interconnection design changes the geometric parameters (oblique extension, increased connection area) to compensate for the reduced chip size. By extending interconnections obliquely and increasing the connection area, the electrical resistance is reduced despite the miniaturization of the overall device, thus maintaining reliability while achieving compactness.
3Reliability
If interconnection connecting sections are designed with bend parts to circumvent obstacles, then electrical connection quality is improved, but the structural complexity increases
Solution Approach 1:
The interconnection structure is segmented into distinct portions: a main body portion and a bend part. This segmentation allows the interconnection to navigate around obstacles while keeping the overall design manageable. The bend part can be formed through standard fabrication processes, and the segmented structure simplifies alignment and assembly operations.
Data Source
AI summary
A head chip, a liquid jet head, and a liquid jet recording device capable of achieving the miniaturization while enhancing the reliability are provided. The head chip according to an embodiment of the disclosure includes an actuator plate having a plurality of ejection grooves arranged side by side in a first direction, a plurality of non-ejection grooves arranged side by side along the first direction, and individual electrodes respectively formed in the plurality of non-ejection grooves, a nozzle plate having a plurality of nozzle holes individually communicated with the plurality of ejection grooves, and a cover plate adapted to cover the actuator plate. The cover plate has interconnection connecting sections respectively disposed in end part areas along a second direction perpendicular to the first direction, and adapted to electrically connect a plurality of individual interconnections electrically connected to the individual electrodes to an interconnection board outside the head chip. The plurality of individual interconnections in the interconnection connecting section has a bend part extending in an oblique direction crossing the second direction so as to circumvent a predetermined obstacle. A connection area between the plurality of individual interconnections and the interconnection board in the interconnection connecting section is an area including the bend part.