Oblique Laser Cutting for OLED Substrates
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Solution Overview
Problem
Conventional laser cutting methods using short pulse lasers can cause thermal damage to circuit patterns in organic light-emitting devices due to excessive energy penetration during the cutting process, affecting the integrity of the device.
Innovation Solution
A laser cutting method that slantly irradiates a laser beam at an oblique angle with respect to the cutting surface, utilizing a completely polarized laser beam to minimize energy penetration by adjusting the incidence and refraction angles to satisfy Brewster's angle, thereby reducing thermal damage to the circuit pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam with short pulse is used to cut the second substrate, then the cutting speed and efficiency are improved, but thermal damage occurs to the circuit pattern due to excessive energy penetration
Solution Approach 1:
The patent changes the incidence angle parameter of the laser beam from perpendicular to oblique (specifically satisfying Brewster's angle), which fundamentally alters the energy penetration characteristics. This parameter change allows maintaining high cutting efficiency while reducing thermal damage to the circuit pattern below the second substrate
Solution Approach 2:
The patent introduces a new dimensional approach by irradiating the laser beam at an oblique angle rather than perpendicular to the substrate surface. This angular dimension change transforms the energy distribution pattern, causing the laser energy to travel along a longer path and reduce penetration depth, thereby protecting the circuit pattern while maintaining cutting effectiveness
2Productivity
If the laser beam is irradiated perpendicularly to the cutting surface, then the cutting process is simple and efficient, but energy penetrates deeply and damages adjacent circuit patterns
Solution Approach 1:
The patent modifies the incidence angle parameter from 90 degrees (perpendicular) to an oblique angle satisfying Brewster's angle. This parameter change optimizes the balance between cutting efficiency and circuit pattern protection by controlling energy penetration depth through angular adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces energy per unit area on the circuit pattern, minimizing thermal damage and improving the efficiency of the cutting process while preventing defects in the organic light-emitting device.
Implementation Method 1
the laser beam being bi-directionally polarized after being refracted at the upper surface of the second substrate
Implementation Method 2
A part of the bi-directionally polarized laser beam may be reflected at a bottom surface of the second substrate
Implementation Method 3
A refraction angle of the laser beam may satisfy a Brewster's angle. An incidence angle of the laser beam may satisfy a Brewster's angle
Data Source
AI summary
A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.