Oblique Scattering Body for Compact Surface Light Source
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Solution Overview
Problem
Conventional surface light sources are inefficient and bulky, lacking in color mixing and uniform illumination, especially in applications like liquid crystal display backlighting, due to their limited geometrical dimensions and emission characteristics.
Innovation Solution
A surface light source comprising optoelectronic semiconductor chips and a scattering body that deflects primary radiation into oblique main emission directions, allowing for a compact, high-efficiency design with uniform radiation and sufficient color mixing, achieved by using a scattering body with a specific shape and orientation relative to the semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional surface light sources are used, then they provide illumination, but they are inefficient and have large geometrical dimensions
Solution Approach 1:
The patent transitions from point light sources to an extended surface light source by distributing multiple semiconductor chips across a planar array. This dimensional change from 0D to 2D enables compact integration while maintaining high efficiency, as the surface emits light uniformly across its area rather than from a single point, thereby improving productivity without increasing volume.
Solution Approach 2:
The patent combines multiple semiconductor chips into a single integrated surface light source structure. By merging numerous individual light-emitting elements into one unified device with a common scattering body, the system achieves high efficiency through collective emission while maintaining compact dimensions, resolving the contradiction between productivity and volume.
2Illumination intensity
If conventional surface light sources are used, then they provide illumination, but they lack uniform illumination and color mixing
Solution Approach 1:
The patent introduces a scattering body as an intermediary element positioned between the semiconductor chips and the output surface. This scattering body receives light from multiple chips and redistributes it uniformly across the surface, achieving homogeneous illumination and effective color mixing without requiring complex individual chip control, thus improving illumination uniformity while managing device complexity.
Solution Approach 2:
The patent applies local quality by positioning scattering bodies in specific locations relative to each semiconductor chip. Each scattering body is locally optimized to distribute light from its associated chip(s) in a controlled manner, ensuring that each region of the surface receives uniform illumination and appropriate color mixing, thereby achieving overall uniformity through localized optimization.
3Ease of operation
If the scattering body is disposed downstream of the radiation main side, then it scatters the primary radiation, but it increases the structural height
Solution Approach 1:
The patent applies partial action by using a scattering body that is optimized to provide sufficient scattering function without excessive height. The scattering body is designed with minimal thickness required to achieve the necessary light redistribution and color mixing, thereby maintaining high optical efficiency while keeping the structural height compact and acceptable for the application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, high-efficiency surface light source with uniform illumination and efficient color mixing, suitable for general lighting and liquid crystal display backlighting, while maintaining a small structural height and preferred polarization.
Implementation Method 1
The at least one scattering body (3) is configured for scattering the primary radiation (P)
Data Source
AI summary
In at least one embodiment, a surface light source includes one or a more optoelectronic semiconductor chips having a radiation main side for generating a primary radiation. A scattering body is disposed downstream of the radiation main side along a main emission direction of the semiconductor chips. The scatting body is designed for scattering the primary radiation. A main emission direction of the scattering body is oriented obliquely with respect to the main emission direction of the semiconductor chip.