Oblique Through Hole Substrate via Anisotropic Etching
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Solution Overview
Problem
Existing methods for manufacturing substrates with obliquely running through holes face challenges in achieving a high pitch conversion rate and smooth liquid flow due to limitations in etching precision and interference between holes, leading to unnecessarily large diameters and increased pitch arrangements.
Innovation Solution
A method involving anisotropic dry etching with strategically arranged masks on opposite surfaces of a substrate to form cavities that communicate and create obliquely running through holes with controlled angles and dimensions, allowing for efficient pitch conversion and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If isotropic etching is used to form through holes, then the etching process is simple, but the through hole diameter becomes unnecessarily large and pitch arrangement increases
Solution Approach 1:
The patent changes the etching parameter from isotropic to anisotropic etching. This parameter change allows the etching direction to be controlled, enabling the formation of through holes with precise diameter control and desired profiles, thereby resolving the contradiction between manufacturing simplicity and dimensional precision.
Solution Approach 2:
The patent introduces asymmetric mask arrangements where masks on opposite surfaces are positioned at different locations. This asymmetric configuration, combined with anisotropic etching, enables precise control over through hole trajectories and diameters, allowing pitch conversion while maintaining manufacturing feasibility.
2Loss of time
If mask openings are separated too much horizontally, then the etching operation time increases, but the through hole diameter becomes larger requiring increased pitch arrangement
Solution Approach 1:
The patent optimizes the etching parameters including the horizontal separation distance between mask openings and the etching time. By carefully controlling these parameters, the patent achieves efficient etching operations that connect cavities without excessive diameter enlargement, thereby reducing both time loss and pitch requirements.
3Ease of manufacture
If through holes have warped profiles with unnecessarily aggrandized diameters, then the manufacturing process is simple, but liquid flow smoothness deteriorates and pitch conversion efficiency decreases
Solution Approach 1:
The patent changes the etching mode from isotropic to anisotropic, which fundamentally alters the through hole profile from warped to controlled and smooth. This parameter change maintains manufacturing feasibility while significantly improving liquid flow characteristics and pitch conversion efficiency.
Solution Approach 2:
The patent performs preliminary mask arrangement and cavity formation from opposite surfaces before final through hole completion. This preliminary action ensures that cavities are properly positioned and sized, enabling smooth through hole formation that optimizes liquid flow without requiring excessive post-processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of substrates with efficiently converted pitch arrangements and smooth liquid flow paths, overcoming the limitations of previous techniques by producing through holes with desired profiles and angles, thus enhancing the manufacturing of liquid ejection heads.
Implementation Method 1
forming a plurality of cavities respectively facing the plurality of openings of the first mask by executing an anisotropic dry etching operation from the first surface by way of the first mask and forming a plurality of cavities respectively facing the plurality of openings of the second mask by executing an anisotropic dry etching operation from the second surface by way of the second mask
Data Source
AI summary
A substrate having an obliquely running through hole is manufactured by arranging first and second masks each having an opening pattern on first and second surfaces, respectively, of the substrate, then forming cavities each facing an opening of the opening patterns from the respective surfaces by anisotropic dry etching, and making the cavities formed from the first surface and the cavities formed from the second surface communicate with each other to produce the through hole. The opening pattern of the first mask and the opening pattern of the second mask are arranged adjacently to or partially overlapping with each other as viewed from the direction orthogonal to the substrate. The opening area of at least one of the openings of the first and second masks are increased along the direction from the mask including the at least one opening toward the oppositely disposed mask.