Miniaturized OCT Chip Package with Integrated Scanning Unit
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Solution Overview
Problem
The miniaturization of Optical Coherence Tomography (OCT) systems is challenging due to the complexity of components and high coupling sensitivities between optical elements, which hinders the development of compact and efficient imaging devices.
Innovation Solution
An integrated chip package design incorporating a photonic integrated circuit (PIC) manufactured using Silicon-On-Insulator technology, with optical, opto-electrical, and electrical elements such as a heat spreader, fiber mount, polarizing element, lens array, and scanning unit, optimized for high coupling efficiency and thermal management, to create a miniaturized OCT system capable of 2D imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional OCT system components are used, then imaging function is achieved, but system size becomes large and complex
Solution Approach 1:
The patent integrates multiple discrete OCT components (light source, optical elements, detectors) onto a single photonic integrated circuit chip. This merging of components directly reduces system volume while managing complexity through integration, resolving the contradiction between miniaturization and component complexity.
Solution Approach 2:
The photonic integrated circuit serves multiple functions simultaneously: generating light, guiding optical paths, performing interferometric measurements, and detecting signals. This multi-functionality allows the system to maintain full OCT imaging capability while reducing the number of separate components, thereby decreasing system size without sacrificing functionality.
2Volume of moving object
If optical components are miniaturized, then system size is reduced, but coupling sensitivity increases
Solution Approach 1:
The patent employs intermediary structures such as mode field adapters and tapered waveguides between optical components on the chip. These intermediaries act as transition zones that match impedance and mode fields between different optical elements, reducing coupling sensitivity to misalignment while maintaining miniaturization benefits.
Solution Approach 2:
The photonic integrated circuit utilizes parameter changes in waveguide dimensions and refractive indices to optimize coupling between components. By carefully controlling waveguide geometry and material properties, the system achieves robust coupling that is tolerant to manufacturing variations and alignment errors, thereby improving reliability despite miniaturization.
3Loss of energy
If multiple optical elements are integrated, then coupling efficiency improves, but thermal management becomes challenging
Solution Approach 1:
The patent extracts the thermal management function from the optical chip by integrating a separate heat sink structure. This heat sink is thermally coupled to the photonic integrated circuit to conduct heat away from sensitive optical components, thereby maintaining stable operating temperatures while preserving the high coupling efficiency benefits of integration.
Solution Approach 2:
The patent employs composite material structures combining different thermal and optical properties. The photonic integrated circuit uses materials optimized for optical performance, while thermal management interfaces use materials with high thermal conductivity. This composite approach allows simultaneous optimization of optical coupling efficiency and thermal dissipation in the miniaturized system.
Data Source
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AI summary
A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.