OCXO Connection Structure Using Adhesive and Wire Bonding
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Solution Overview
Problem
Existing oven-controlled crystal oscillators face challenges in achieving high reliability in both mechanical and electrical connections between the core section and the package, which affects the device's overall performance.
Innovation Solution
The oven-controlled crystal oscillator employs a configuration where the mechanical connection of the core section to the package is made using a non-conductive bonding material, while the electrical connection is established through wire bonding, allowing for separate optimization of both connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If mechanical connection and electrical connection are integrated using a conductive bonding material, then the device structure is simplified, but the reliability of mechanical connection decreases under external stress and common impedance noise is generated
Solution Approach 1:
The patent divides the connection function into two separate connections: a mechanical connection using non-conductive bonding material and an electrical connection using wire bonding. This segmentation allows each connection to be optimized independently, preventing the mechanical connection from bearing electrical current and thus eliminating common impedance noise while maintaining mechanical strength
Solution Approach 2:
The patent introduces wire bonding as an intermediary element for electrical connection, separating it from the mechanical bonding material. The wire bonding serves as a dedicated electrical pathway that does not compromise the mechanical connection's integrity or introduce noise, resolving the conflict between structural simplicity and connection reliability
2Strength
If a rigid bonding material is used for mechanical connection, then the mechanical strength is high, but the connection is sensitive to external stress and thermal expansion mismatch
Solution Approach 1:
The patent changes the key parameter of the bonding material from conductive to non-conductive, selecting materials with appropriate mechanical properties such as epoxy resin or polyimide. These materials provide sufficient mechanical strength while being less sensitive to thermal expansion differences and external stress, thereby improving connection reliability without sacrificing strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of both mechanical and electrical connections, reducing the likelihood of connection failures due to external stress and improving carrier noise characteristics by minimizing common impedance noise.
Implementation Method 1
A rear surface of the core section is mechanically connected to the package by a bonding material
Implementation Method 2
The core section and the package are electrically connected to each other by wire bonding
Implementation Method 3
a heat insulation package in which the core section is hermetically encapsulated
Data Source
AI summary
An OCXO according to one or more embodiments may include a core section hermetically encapsulated inside a heat insulation package. The core section includes: an oscillation IC; a crystal resonator; and a heater IC, and furthermore is supported by the package via a core substrate. The core substrate is mechanically connected to the package by a non-conductive adhesive. The core section and the package are electrically connected to each other by wire bonding using wires.