OCXO Package Structure With Air Cavity Thermal Isolation
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Solution Overview
Problem
Existing semiconductor package structures for oven-controlled crystal oscillators (OCXO) face challenges in maintaining constant temperature and reducing heat loss, leading to increased power consumption and manufacturing costs due to the use of ceramic cavity substrates and additional insulating layers.
Innovation Solution
The use of an air cavity or vacuum cavity as a heat conduction retardation zone, combined with an organic substrate having a lower thermal conductivity than ceramic substrates, effectively reduces heat loss and maintains the crystal unit at a constant temperature, thereby reducing power consumption and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ceramic cavity substrates and additional insulating layers are used, then thermal insulation is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent extracts the heat conduction retardation function from the substrate itself and implements it through a separate air cavity or vacuum cavity structure. By creating a dedicated thermal isolation zone between the oscillator chip and substrate, the patent achieves effective thermal insulation without requiring the entire substrate to be made of ceramic or adding multiple insulating layers, thus reducing device complexity while maintaining thermal performance.
Solution Approach 2:
The patent introduces an air cavity or vacuum cavity as an intermediary thermal isolation zone between the oscillator chip and the substrate. This intermediary structure acts as a heat conduction barrier, effectively retarding heat transfer from the substrate to the crystal unit without requiring direct contact between the chip and substrate, thereby achieving thermal insulation with simpler manufacturing compared to ceramic substrates.
2Temperature
If ceramic cavity substrates are used, then thermal insulation is improved, but power consumption increases
Solution Approach 1:
The air cavity or vacuum cavity serves as a thermal intermediary that reduces heat loss from the oscillator chip to the environment. By introducing this thermal barrier, less heating power is required to maintain the crystal unit at constant temperature, thereby reducing overall power consumption while achieving effective thermal insulation.
Solution Approach 2:
The patent changes the thermal conductivity parameter by introducing an air cavity or vacuum cavity (which have very low thermal conductivity) between the oscillator chip and substrate. This parameter change creates a thermal barrier that reduces heat loss, allowing the system to maintain temperature with lower power input compared to direct substrate contact.
3Ease of manufacture
If organic substrate is used instead of ceramic substrate, then manufacturing cost is reduced, but thermal insulation performance may deteriorate
Solution Approach 1:
The patent introduces an air cavity or vacuum cavity as a thermal intermediary between the organic substrate and the oscillator chip. This intermediary structure compensates for the potentially higher thermal conductivity of organic substrates by providing a dedicated heat conduction barrier, thereby maintaining thermal insulation performance while allowing the use of cost-effective organic substrate materials.
Solution Approach 2:
The patent segments the thermal management function from the substrate itself by creating a separate air cavity or vacuum cavity structure. This segmentation allows the organic substrate to serve its primary mechanical and electrical functions while the separate cavity structure handles thermal insulation, enabling the use of lower-cost organic materials without sacrificing thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal insulation, improves the frequency stability of the OCXO, and reduces power consumption while lowering manufacturing costs compared to traditional ceramic-based solutions.
Implementation Method 1
The use of an air cavity or vacuum cavity as a heat conduction retardation zone, combined with an organic substrate having a lower thermal conductivity than ceramic substrates, effectively reduces heat loss
Implementation Method 2
The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate
Data Source
AI summary
The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.