OCXO Common Package Assembly for Multi-Frequency Production
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Solution Overview
Problem
Existing methods for manufacturing oven-controlled crystal oscillators (OCXO) are inefficient and costly when producing multiple types with different resonator elements, as they require separate manufacturing processes for each type.
Innovation Solution
A common package design is used to manufacture multiple types of OCXO by employing a common structure with interchangeable resonator and circuit elements, allowing for efficient and cost-effective production of oscillators with varying oscillation frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate manufacturing processes are used for each oscillator type with different resonator elements, then manufacturing precision and reliability are maintained, but productivity is reduced and manufacturing cost increases
Solution Approach 1:
The patent applies universality by designing a common package structure that can accommodate multiple types of resonator elements (first resonator element and second resonator element with different characteristics) and circuit elements. The package includes a standardized mounting structure with a lower surface for mounting resonator elements and an upper surface for mounting circuit elements, allowing the same package design to be used across different oscillator types. This multi-functional package design enables a single manufacturing process to produce various oscillator types, thereby improving productivity while maintaining manufacturing precision through standardized procedures.
2Ease of manufacture
If a common package design is used for multiple oscillator types, then productivity increases and cost decreases, but manufacturing precision may be compromised due to varying resonator element characteristics
Solution Approach 1:
The patent applies local quality by providing different types of resonator elements (first resonator element and second resonator element with different characteristics) within the same common package structure. Each resonator element type is mounted on the lower surface of the package in a standardized location, while the upper surface accommodates corresponding circuit elements tailored to each resonator type. This allows the manufacturing process to be standardized at the package level while maintaining precision through localized customization of resonator and circuit element combinations, thereby reducing cost without compromising frequency control precision.
3Adaptability or versatility
If multiple resonator elements with different characteristics are mounted in the same package, then adaptability increases, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the oscillator into distinct functional modules: a common package structure, resonator elements (first and second types), and circuit elements. The package is segmented with specific mounting areas - the lower surface for resonator elements and the upper surface for circuit elements. This modular segmentation allows different combinations of resonator and circuit elements to be assembled in the same package type, increasing adaptability to produce various oscillator types while keeping the package structure itself relatively simple and standardized.
Data Source
AI summary
A method for manufacturing oscillators of a plurality of types including a first oscillator and a second oscillator, the method includes: manufacturing the first oscillator, the manufacturing the first oscillator including a first-oscillator first step of mounting, to a first container, a first resonator element and a first circuit element configured to oscillate the first resonator element to generate a first oscillation signal, and a first-oscillator second step of mounting, to the first container, a second resonator element whose oscillation frequency is controlled based on the first oscillation signal; and manufacturing the second oscillator, the manufacturing the second oscillator including a second-oscillator first step of mounting a third resonator element and a second circuit element to a second container of the same type as the first container, the third resonator element being of the same type as the first resonator element and the second circuit element being of the same type as the first circuit element and being configured to oscillate the third resonator element to generate a second oscillation signal, and a second-oscillator second step of mounting, to the second container, a fourth resonator element whose oscillation frequency is controlled based on the second oscillation signal and whose frequency is different from the frequency of the second resonator element.