Oven-Controlled Crystal Oscillator Layout for Lower Heat Loss
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Solution Overview
Problem
In oven-controlled crystal oscillators, heat transfer through connection parts between the core substrate and package increases heat consumption, leading to inefficiencies.
Innovation Solution
The core section is hermetically encapsulated in a heat-insulating package and supported by a core substrate connected outside the core section's area, with void spaces and recess parts to minimize heat transfer and use a sandwich-structured piezoelectric resonator for hermetic sealing without adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the core substrate is connected to the package using conductive adhesive, then electrical connection is achieved, but heat transfer occurs from the core section to the package, increasing heat consumption
Solution Approach 1:
The connection between core substrate and package is segmented into multiple independent connection parts positioned at different locations. This segmentation allows electrical connection to be maintained while distributing and minimizing heat transfer paths, as each connection part is optimized for its specific function without compromising the other.
Solution Approach 2:
An intermediary structure or material is introduced between the core substrate and the package at the connection parts. This intermediary serves as a thermal barrier while maintaining electrical conductivity, thus reducing heat transfer to the package while preserving the necessary electrical connection for device operation.
2Strength
If connection parts are provided at positions superimposed on the core section, then structural support is improved, but heat transfer from the core section to the package increases
Solution Approach 1:
The connection parts are positioned in a different spatial arrangement relative to the core section. Instead of being directly superimposed, the connection parts are located at positions that provide structural support through alternative geometric configurations, thereby reducing direct thermal coupling while maintaining mechanical strength.
3Reliability
If the core section is hermetically sealed with adhesive, then hermetic sealing is achieved, but thermal convection occurs and temperature control accuracy decreases
Solution Approach 1:
The adhesive material that causes thermal convection is extracted or removed from the hermetic sealing process. Alternative hermetic sealing methods are employed that do not involve adhesive materials, thereby eliminating the source of thermal convection while maintaining the hermetic sealing function to protect the core section.
4Loss of energy
If heat insulation is improved by increasing distance between core substrate and package, then heat loss is reduced, but structural stability decreases
Solution Approach 1:
The spacing between core substrate and package is optimized locally rather than uniformly. In regions where heat insulation is critical, larger distances are maintained to reduce heat loss. In regions where structural stability is paramount, smaller distances or enhanced support structures are used to maintain mechanical integrity. This local optimization balances thermal and mechanical requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces heat generation and power consumption while maintaining temperature stability, preventing thermal convection, and ensuring accurate temperature control.
Implementation Method 1
the heat quantity (the amount of heat) generated by a heating element (heat source) of the heater IC is controlled. Thus, the temperature of the core section is kept constant.
Implementation Method 2
The core section is hermetically encapsulated in a heat-insulating package.
Data Source
AI summary
An oven-controlled crystal oscillator according to one or more embodiments includes a core section having at least an oscillation IC, a crystal resonator, and a heater IC. The core section is hermetically encapsulated in a heat-insulating package. The core section is supported by the package via a core substrate. The core substrate is connected to the package outside a region where the core section is provided in plan view.