OCXO Package Structure for Thermal Isolation and Reliable Bonding
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Solution Overview
Problem
Existing oven-controlled crystal oscillators face challenges in achieving high reliability in both mechanical and electrical connections, as well as inadequate thermal insulation of the core section.
Innovation Solution
The oven-controlled crystal oscillator incorporates a core section with an oscillation IC, a piezoelectric resonator, and a heater IC, mounted on a flexible substrate that is mechanically connected to the package using a bonding material and electrically connected via wire bonding. A space is created between the flexible substrate and the package bottom surface to enhance thermal insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the core section is directly mounted on the package, then the device complexity is reduced, but the thermal insulation performance deteriorates
Solution Approach 1:
The flexible substrate acts as an intermediary layer between the core section and the package, providing thermal insulation while maintaining structural support. This intermediary layer prevents direct thermal contact between the temperature-sensitive core section and the package, thereby improving thermal insulation performance without significantly increasing device complexity.
Solution Approach 2:
The patent applies local quality by providing thermal insulation specifically at the interface between the core section and package through the flexible substrate. This localized approach to thermal management allows the rest of the device to maintain simple construction while the critical area receives enhanced thermal protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration separates mechanical and electrical connections, ensuring high reliability in both, and improves thermal insulation by creating a space under the flexible substrate, thereby enhancing the stability and temperature control of the oven-controlled crystal oscillator.
Implementation Method 1
The core section is mounted on a flexible substrate that is mechanically connected to the package by a bonding material
Implementation Method 2
The core section and the package are electrically connected to each other by wire bonding
Implementation Method 3
A space is provided between the flexible substrate and a bottom surface of the package... it is possible to improve thermal insulation of the core section
Implementation Method 4
In a piezoelectric resonator such as a crystal resonator, the vibration frequency changes depending on the temperature according to its frequency temperature characteristics
Implementation Method 5
a heater IC... In order to keep the temperature around the piezoelectric resonator constant, an oven-controlled crystal (Xtal) oscillator
Data Source
AI summary
One or more embodiments of the disclosure may be an oven-controlled crystal oscillator that may include a core section hermetically encapsulated inside a thermal insulation package. The core section includes at least: an oscillation IC; a crystal resonator; and a heater IC. The core section is mounted on a core substrate that is mechanically connected to the package by a non-conductive adhesive. The core section and the package are electrically connected to each other by wire bonding. A space is provided between the core substrate and a bottom surface of the package.