Odd-Layer Circuit Board Fabrication via Liquid Adhesion
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Solution Overview
Problem
Current circuit board fabrication methods primarily produce boards with an even number of layers, failing to efficiently manufacture those with an odd number of layers, which is increasingly demanded by advanced circuit designs.
Innovation Solution
A method using a liquid material and atmospheric pressure difference to adhere substrates, allowing for the formation of conductive columns and subsequent patterning to create circuit layers, enabling the mass production of circuit boards with both odd and even numbers of layers greater than three.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional circuit board fabrication methods are used, then circuit boards with even number of layers can be manufactured, but circuit boards with odd number of layers cannot be efficiently manufactured
Solution Approach 1:
The invention divides the circuit board fabrication process into distinct modular steps: forming first and second substrates with metal layers and dielectric layers separately, then joining them through a liquid material. This segmentation allows independent control of each substrate's layer structure, enabling the creation of odd-numbered total layers by combining substrates with specific layer configurations.
Solution Approach 2:
The invention introduces a liquid material as an intermediary substance to join the first and second substrates. This liquid material serves as a mediator that facilitates the bonding between substrates while allowing for precise control of the joining process, enabling the formation of complex multi-layer structures with odd total layer counts that would be difficult to achieve with conventional direct-bonding methods.
2Adaptability or versatility
If conventional fabrication processes are used, then even-layered circuit boards can be produced, but the process cannot accommodate diverse circuit design requirements for odd-layered boards
Solution Approach 1:
The invention implements a dynamic fabrication process where the number and configuration of metal layers on each substrate can be independently adjusted. By controlling the liquid material to adhere to specific metal layers and allowing for selective patterning, the process can adapt to produce various layer configurations including odd-numbered total layers, providing flexibility for different circuit design requirements.
Solution Approach 2:
The invention applies local quality control by selectively adhering the liquid material to specific metal layers on the substrates. This localized adhesion allows different regions of the circuit board to have different layer configurations, enabling complex circuit designs with odd total layers while maintaining manageable process complexity through targeted rather than universal processing.
3Productivity
If traditional lamination methods are used, then standard even-layered boards can be fabricated, but mass production of odd-layered boards remains unachievable
Solution Approach 1:
The invention performs preliminary actions by pre-forming the first and second substrates with their respective metal layers and dielectric layers before joining. This preliminary preparation allows each substrate to be optimized independently, and when joined through the liquid material, enables efficient mass production of odd-layered circuit boards by avoiding the need for complex in-process adjustments.
Solution Approach 2:
The invention utilizes the liquid material's properties (analogous to pneumatic and hydraulic principles) to control adhesion and bonding. The liquid material can be applied and controlled to adhere to specific metal layers, enabling precise and efficient joining of substrates for mass production of odd-layered boards by leveraging fluid dynamics for controlled material placement and bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of circuit boards with varying layer counts, accommodating diverse circuit designs by allowing for the production of both odd and even numbered layers, thereby meeting the demands of advanced technology.
Implementation Method 1
a liquid material is adhered between a first substrate and a second substrate by using an atmospheric pressure difference
Data Source
AI summary
A fabricating method of a circuit board including the following steps. First, a liquid material is adhered between a first substrate and a second substrate by using an atmospheric pressure difference. Then, a plurality of conductive columns are formed in the first substrate and the second substrate. Next, a patterning process is performed, so as to form two circuit layers. Next, two lamination structures are formed respectively on the circuit layers. Then, the first substrate and the second substrate are separated. Finally, another patterning process is performed, so as to finish the fabrication of the circuit board.