On-Die Termination Circuit Dynamic Resistance Adjustment
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Solution Overview
Problem
Semiconductor devices face challenges in achieving high-speed data transmission due to impedance mismatch, leading to signal distortion and issues like setup/hold failure and miss-judgment, as the operational speeds increase and signal swing widths decrease, making it difficult to maintain effective impedance matching.
Innovation Solution
The implementation of an on-die termination (ODT) device with a calibration circuit that generates calibration codes to control the termination resistance of data input/output pads, using a combination of on-die termination units and external resistors, allowing for adjustable termination resistance to match impedance and reduce current consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If impedance matching circuit is installed to address signal distortion and setup/hold failure, then data transmission reliability is improved, but current consumption increases
Solution Approach 1:
The patent implements dynamic termination resistance adjustment by controlling multiple termination units (first and second termination units with different resistance values) based on detected signal quality. The system switches between strong termination (first termination unit) when signal distortion is detected and weak termination (second termination unit) when signal quality is good, optimizing both reliability and power consumption adaptively
Solution Approach 2:
The patent changes the termination resistance parameter dynamically based on signal conditions. By detecting setup/hold failures and signal distortion, the system adjusts the termination resistance between two distinct values (strong and weak termination), allowing the system to optimize the trade-off between data transmission reliability and current consumption based on real-time signal quality
2Reliability
If strong termination is applied to reduce signal distortion, then impedance matching is improved, but current consumption increases
Solution Approach 1:
The patent implements dynamic termination resistance adjustment by controlling multiple termination units (first and second termination units with different resistance values) based on detected signal quality. The system switches between strong termination (first termination unit) when signal distortion is detected and weak termination (second termination unit) when signal quality is good, optimizing both reliability and power consumption adaptively
Solution Approach 2:
The patent changes the termination resistance parameter dynamically based on signal conditions. By detecting setup/hold failures and signal distortion, the system adjusts the termination resistance between two distinct values (strong and weak termination), allowing the system to optimize the trade-off between data transmission reliability and current consumption based on real-time signal quality
3Use of energy by moving object
If termination resistance is increased to reduce current consumption, then power efficiency is improved, but impedance matching deteriorates
Solution Approach 1:
The patent implements dynamic termination resistance adjustment by controlling multiple termination units (first and second termination units with different resistance values) based on detected signal quality. The system switches between strong termination (first termination unit) when signal distortion is detected and weak termination (second termination unit) when signal quality is good, optimizing both reliability and power consumption adaptively
Solution Approach 2:
The patent changes the termination resistance parameter dynamically based on signal conditions. By detecting setup/hold failures and signal distortion, the system adjusts the termination resistance between two distinct values (strong and weak termination), allowing the system to optimize the trade-off between data transmission reliability and current consumption based on real-time signal quality
Data Source
AI summary
Example embodiments disclose a semiconductor device having an on-die termination (ODT) structure that reduces current consumption, and a termination method performed in the semiconductor device. The semiconductor device includes a calibration circuit for generating calibration codes in response to a reference voltage and a voltage of a calibration terminal connected to an external resistor and an on-die termination device for controlling a termination resistance of a data input/output pad in response to the calibration codes and an on-die termination control signal. The termination resistance of the data input/output pad is greater than a resistance of the calibration terminal.


