OE-PCB Waveguide Bending Structure for Alignment
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Solution Overview
Problem
The challenges in fabricating photonic assemblies include defining optical waveguides and establishing optical interconnections between optical-electrical integrated circuits (OE-ICs) and optical-electrical printed circuit boards (OE-PCBs), primarily due to bending requirements, the large number of optical interconnections, and alignment issues associated with optical waveguide interconnections.
Innovation Solution
The solution involves an optical-electrical printed circuit board (OE-PCB) with an integrated optical waveguide array sandwiched between PCB layers, featuring a waveguide link assembly with accessible end faces and a bending structure to secure optical waveguides, allowing for optical coupling with OE-IC devices, along with an optical interconnector to establish connections between the OE-PCB and OE-IC.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If optical waveguides are used for high-bandwidth communication, then communication bandwidth is improved, but bending requirements and alignment issues make fabrication problematic
Solution Approach 1:
The patent merges the optical waveguide array with the PCB structure by embedding the waveguides between PCB layers and integrating the waveguide bending structure directly into the PCB assembly. This combination allows optical interconnections to be manufactured as part of the PCB fabrication process, improving ease of manufacture while maintaining high bandwidth capabilities
Solution Approach 2:
The patent introduces a waveguide bending structure as an intermediary component that facilitates the transition from straight waveguides to bent configurations required for connecting OE-ICs to OE-PCBs. This intermediary structure resolves the bending requirements by providing a dedicated mechanism for waveguide routing without compromising alignment precision
2Power
If optical waveguide interconnections are established between OE-ICs and OE-PCBs, then high-bandwidth communication is achieved, but alignment precision becomes problematic
Solution Approach 1:
The patent implements preliminary alignment actions by pre-positioning the optical waveguide array between PCB layers and pre-configuring the waveguide bending structure before final OE-IC attachment. This preliminary setup establishes precise alignment references that guide subsequent bonding processes, ensuring accurate optical coupling without requiring complex real-time alignment adjustments
Solution Approach 2:
The patent replaces traditional mechanical alignment systems with an integrated waveguide bending structure that provides inherent alignment guidance. The bending structure's geometry and positioning replace complex mechanical alignment mechanisms, achieving precise optical coupling through structural design rather than mechanical adjustment
3Adaptability or versatility
If a large number of optical interconnections are made, then communication capability is improved, but the complexity of establishing all interconnections increases
Solution Approach 1:
The patent segments the optical interconnection system into modular components: an optical waveguide array with multiple individual waveguides, a waveguide bending structure, and OE-IC devices. Each segment can be independently fabricated, positioned, and tested, reducing the overall complexity of establishing numerous interconnections while maintaining high communication capability through parallel waveguide channels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient optical coupling and alignment of optical waveguides with OE-IC devices, overcoming the challenges of bending and alignment, thereby facilitating high-bandwidth communication in photonic assemblies.
Implementation Method 1
an array of optical waveguides each having a first-end section with an end face and a second end
Data Source
AI summary
The optical-electrical printed circuit board disclosed herein includes a waveguide link assembly and a printed circuit board assembly. The printed circuit board assembly has first and second PCB layers between which optical waveguides of the waveguide link assembly are disposed. The end faces the optical waveguides are accessible through an access aperture in the printed circuit board assembly. An optical interconnector can be used to optically connect the optical waveguides to waveguides of an optical-electrical integrated circuit operably disposed on the printed circuit board assembly to form a photonic device. A waveguide bending structure can be used to bend the optical waveguides to facilitate optical coupling to the optical interconnector or directly to the waveguides of the optical-electrical integrated circuit. Methods of forming an optical-electrical printed circuit board, a photonic assembly and a photonic device are also disclosed.