Off-Center Wafer Rotation for Uniform Microwave Film Deposition
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Solution Overview
Problem
The issue of film thickness uniformity deterioration due to the formation of thick and thin portions in the circumferential direction of a substrate during electromagnetic wave-induced heating, particularly in high-density substrates with high aspect ratio patterns, is addressed.
Innovation Solution
A substrate processing apparatus with a rotator configuration that includes an off-centered output shaft and a substrate holder, combined with a microwave generator and a process chamber, to improve film thickness uniformity by controlling the rotation and revolution of substrates, using a drive mechanism with an off-centered rotation axis to mitigate the effects of standing waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electromagnetic wave heating is used for high-density substrates with high aspect ratio patterns, then the modifying process can be performed on miniaturized substrates, but standing waves cause non-uniform heating and film thickness deterioration
Solution Approach 1:
The substrate holder is designed to rotate the substrate during the electromagnetic wave heating process. This dynamic rotation prevents the formation of standing waves that cause non-uniform heating, thereby maintaining film thickness uniformity while enabling processing of high-density substrates with high aspect ratio patterns
Solution Approach 2:
The substrate holder features an off-centered rotation axis that is positioned at a specific distance from the substrate surface. This asymmetric configuration creates a controlled rotation path that effectively distributes electromagnetic wave energy, preventing hot spots and standing waves while maintaining processing efficiency
2Manufacturing precision
If the substrate is rotated during electromagnetic wave heating, then film thickness uniformity is improved, but the device complexity increases due to the rotator mechanism
Solution Approach 1:
The rotator mechanism is integrated directly with the substrate holder structure. The rotation function is combined with the substrate holding function in a single unified component, eliminating the need for separate complex rotation mechanisms and reducing overall device complexity while maintaining film thickness uniformity
Solution Approach 2:
The substrate holder is designed to rotate automatically during the heating process without requiring external control systems. The rotation is inherently built into the holder mechanism, allowing it to self-regulate the heating distribution and prevent standing waves without adding complex control electronics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces non-uniformity in film thickness by minimizing the impact of standing waves, ensuring more uniform heating and improved film thickness consistency across the substrate.
Implementation Method 1
a microwave generator configured to generate a microwave
Implementation Method 2
In induction heating of radiating an electromagnetic wave to a wafer
Implementation Method 3
a rotator which includes an output shaft configured to support the substrate holder and an input shaft installed at an off-centered position with respect to the output shaft
Data Source
AI summary
There is provided a technique that includes a process chamber configured to process at least one substrate; a microwave generator configured to generate a microwave; a substrate holder configured to load and hold the at least one substrate; and a rotator which includes an output shaft configured to support the substrate holder and an input shaft installed at an off-centered position with respect to the output shaft.