Off-Centered Light Receiving Part Asymmetric Electrode Layout
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Solution Overview
Problem
The downsizing of semiconductor light receiving devices has led to smaller electrode pads, making precise wire bonding crucial to prevent wire protrusion and leakage current, which can degrade device characteristics.
Innovation Solution
A semiconductor light receiving device with a rectangular substrate and a multilayer structure featuring a mesa light receiving part positioned near one corner, with electrode pads arranged such that the minimum distance between the p-side electrode pad and the substrate edge is longer than that between the n-side electrode pads and the edge, reducing the likelihood of wire protrusion and leakage current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electrode pad size is reduced to achieve device downsizing, then the device size is reduced, but wire bonding precision becomes more difficult to control and leakage current increases
Solution Approach 1:
The patent positions the light receiving part off-center on the substrate, creating an asymmetric layout where electrode pads are strategically placed at different distances from substrate edges. This asymmetric arrangement ensures that even with reduced pad sizes, the bonding wires have sufficient clearance from edges, preventing leakage current while maintaining compact device dimensions.
2Volume of moving object
If the electrode pad size is reduced to achieve device downsizing, then the device size is reduced, but leakage current through protruding wires increases
Solution Approach 1:
The patent solves the leakage current problem by transitioning from a symmetric two-dimensional pad arrangement to an asymmetric three-dimensional spatial arrangement. By positioning pads at different distances from substrate edges and offsetting the light receiving part, the design creates additional spatial buffer zones that prevent wire-substrate contact, thereby eliminating leakage current paths in the compact device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective prevention of leakage current and maintains device characteristics, enabling compact semiconductor light receiving devices with reduced degradation.
Implementation Method 1
a light absorbing layer
Data Source
AI summary
A semiconductor light receiving device includes: a substrate having a rectangular shape with first through fourth corners, a multilayer structure formed on the substrate, a light receiving part having a mesa structure positioned at a first corner side from a center part of the rectangular shape of the substrate, a first electrode pad provided on the semiconductor substrate, and a second electrode pad provided on the semiconductor substrate so as to be close to a second corner diagonally opposite to the first corner, a first minimum distance between the second electrode pad and an edge of the substrate being longer than a second minimum distance between the first electrode pad and the edge of the substrate.