Offset Bonding for Electrical Conductors in Compact Spaces
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Solution Overview
Problem
Current electrical bond connection systems face challenges in achieving high current-carrying capacity in compact spaces, particularly in automotive applications, where multiple aluminum ribbons are needed side by side, leading to space constraints and design limitations.
Innovation Solution
An electrical bond connection system is proposed, where a first electrical conductor is bonded to a contact surface with offset bond connections, allowing an additional conductor to be bonded to the first conductor without direct contact, ensuring high current-carrying capacity and preventing detachment of existing bonds during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple individual ribbons are bonded side by side to achieve high current-carrying capacity, then the current-carrying capacity is improved, but the space required increases and layout freedom is restricted
Solution Approach 1:
The patent applies nesting by bonding a second electrical conductor to the first electrical conductor in an offset bond connection, creating a nested configuration where conductors are stacked vertically rather than placed side by side. This allows multiple conductors to occupy a smaller horizontal footprint while maintaining high current-carrying capacity through the nested arrangement.
2Power
If multiple individual ribbons are bonded side by side to achieve high current-carrying capacity, then the current-carrying capacity is improved, but design flexibility is restricted
Solution Approach 1:
The nested configuration allows conductors to be stacked vertically with offset bond connections, providing greater flexibility in routing and positioning compared to rigid side-by-side arrangements. This enables adapted circuit layouts and improved design freedom while maintaining high current capacity.
3Ease of manufacture
If bond connections are applied in direct contact to bond multiple conductors, then the manufacturing process is simplified, but the risk of detaching existing bonds increases
Solution Approach 1:
The patent applies preliminary action by first bonding the first electrical conductor to the contact surface, then bonding the second electrical conductor to the first conductor at an offset location. This sequential bonding at offset positions prevents the bonding tool from interfering with previously formed bonds, eliminating the detachment risk while maintaining manufacturing simplicity.
4Power
If aluminum ribbons with square cross sections are used in ultrasonic bonding, then the current-carrying capacity is achieved, but the manufacturing complexity increases
Solution Approach 1:
The nested configuration with offset bond connections simplifies the manufacturing process by allowing sequential bonding operations without requiring complex tooling or simultaneous multi-point bonding. The vertical stacking arrangement reduces the complexity compared to managing multiple side-by-side ribbons with square cross sections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high current-carrying capacity in a small space with improved manufacturing reliability and flexibility, preventing mechanical damage and allowing for efficient production, including automatic mass production without space constraints.
Implementation Method 1
aluminum ribbons having more or less square cross sections are being used in ultrasonic bonding technology
Implementation Method 2
The bond connections are preferably designed as ultrasonic bond connections and/or thermal bond connections
Implementation Method 3
at least one additional second electrical conductor is bonded to the first electrical conductor via another, third bond connection
Implementation Method 4
The bond connections are preferably designed as ultrasonic bond connections and/or thermal bond connections
Implementation Method 5
first electrical conductor (6, 8), which is bonded to at least one of the contact surfaces via at least one first bond connection (10, 12, 13)
Data Source
AI summary
An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.