Offset Chip Stack Semiconductor Package for Stable High-Capacity Memory
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high-capacity and high-performance semiconductor packages through efficient stacking of semiconductor chips, as existing methods often result in unstable chip stacks and limited memory capacity within a given mounting area.
Innovation Solution
The proposed semiconductor package design incorporates multiple chip stacks with offset structures, connected by a substrate and covered by mold layers, featuring wire bonding and adhesive layers for stability, allowing for efficient stacking and increased memory capacity within a compact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are stacked to increase memory capacity, then storage capacity is improved, but structural stability deteriorates
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of semiconductor chips, utilizing the third dimension (height) to increase memory capacity. Multiple chips are stacked in an offset configuration where upper chips are positioned at different horizontal locations than lower chips, enabling higher density while maintaining structural integrity through the offset arrangement.
Solution Approach 2:
The chip stack is divided into multiple segments or layers with buffer chips positioned between adjacent semiconductor chips. These buffer chips act as intermediate elements that enhance structural stability and provide mechanical support, allowing the stack to maintain stability despite the increased number of chips.
2Quantity of substance
If chips are stacked in a compact area to increase capacity, then memory capacity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs an asymmetric offset stacking configuration where upper semiconductor chips are positioned at different horizontal locations than the chips below them. This asymmetric arrangement optimizes space utilization within the mounting area and simplifies the connection structure by reducing the need for complex alignment mechanisms compared to symmetric stacking.
Solution Approach 2:
Buffer chips are introduced as intermediary elements between adjacent semiconductor chips in the stack. These buffer chips simplify the manufacturing process by providing standardized interfaces and mechanical support, reducing the overall manufacturing complexity despite the increased number of components.
3Stability of the object's composition
If offset stack structure is used to improve stability, then structural stability is improved, but device complexity increases
Solution Approach 1:
The offset stack structure implements local quality by positioning buffer chips specifically at intermediate locations between semiconductor chips where mechanical support is needed. This localized approach enhances structural stability at critical points without requiring complex offset configurations throughout the entire stack, thereby reducing overall device complexity.
Data Source
AI summary
A semiconductor package including first and second chip stacks each including semiconductor chips having an offset stack structure, the second chip stack horizontally spaced apart from the first chip stack, a first buffer chip on the substrate and at a side of the first chip stack, a second buffer chip on the substrate and at a side of the second chip stack, a connection substrate on the first and second chip stacks, a first mold layer covering the substrate, the first chip stack, and the second stack and exposing a top surface of the connection substrate, third and fourth chip stacks each including semiconductor chips having an offset stack structure on the first mold layer and, the fourth chip stack horizontally spaced apart from the third chip stack, and a second mold layer covering the first mold layer, the third chip stack, and the fourth chip stack may be provided.