Offset Printing Cliche Double Etching Bottom Touch
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Solution Overview
Problem
The existing offset printing clichés manufactured by single etching suffer from a bottom touch phenomenon when wide line widths are implemented, leading to issues with conductivity loss and increased manufacturing costs, particularly due to the complexity and expense of glass-based manufacturing processes.
Innovation Solution
A double etching process is introduced to control the bottom touch phenomenon by creating a cliché with varying line widths and etching depths, utilizing a groove pattern that satisfies specific relationship equations (D ≥ 42.9 * exp(-P - W / P / 0.35 - 1.5 and D ≥ 33.8 * exp(-P - W / P / 0.235 + 0.82) for linear and closed figures, respectively, to prevent bottom touch and enable printing without line width limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If single etching method is used to manufacture cliché, then manufacturing process is simple, but bottom touch phenomenon occurs when wide pattern is implemented
Solution Approach 1:
The patent divides the single etching process into multiple etching steps (first etching and second etching) with different etching depths. The first etching creates a base groove pattern, and the second etching selectively deepens specific regions to prevent bottom touch while maintaining overall process simplicity through systematic segmentation of the manufacturing operation.
Solution Approach 2:
The patent applies different etching depths to different regions of the cliché based on local requirements. The groove pattern has a first etching depth in general areas and a second etching depth (deeper) in specific regions where bottom touch prevention is critical, creating local quality variation to solve the printing reliability issue.
2Area of stationary object
If line width is increased to implement wide pattern, then pattern coverage is improved, but bottom touch phenomenon occurs due to printing pressure and blanket roughness
Solution Approach 1:
The patent creates local quality variation in the groove pattern by implementing different etching depths in different regions. Wide pattern regions that are prone to bottom touch receive deeper etching to maintain separation between opposing walls, while other regions maintain standard etching depth, thus preserving print quality across the entire cliché surface.
Solution Approach 2:
The patent addresses the two-dimensional line width issue by introducing a third dimension - etching depth. Instead of merely increasing line width in the horizontal plane, the solution adds vertical depth variation to the groove pattern, creating a three-dimensional structure that prevents bottom touch while maintaining wide pattern coverage.
3Reliability
If fine line hatching is used to solve bottom touch problem, then bottom touch is prevented, but desired conductivity is lost
Solution Approach 1:
The patent applies different etching depths to different functional regions of the cliché. Conductive regions maintain standard groove dimensions to preserve electrical conductivity, while non-conductive or isolated pattern regions receive deeper etching to prevent bottom touch, thus achieving local quality optimization that balances both printing reliability and conductivity requirements.
4Manufacturing precision
If dry etching process is used to solve bottom touch problem, then etching precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple wet etching processes with different etching solutions and parameters to achieve the precision normally requiring dry etching. By merging sequential wet etching steps with controlled depth variation, the solution attains comparable etching precision while avoiding the high manufacturing costs associated with dry etching equipment and materials.
Data Source
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AI summary
The present invention relates to a cliché for offset printing and a method of manufacturing the same, and the cliché for offset printing according to the present invention comprises: a groove pattern, wherein a depth of at least a partial region of the groove pattern is different from a depth of a residual region. The present invention may comprise a double etching process when a cliché for offset printing is manufactured to control a bottom touch phenomenon that is a problem exhibited when a known wide line width is implemented, thus manufacturing the cliché for offset printing having various line widths and etching depths.