Offset Coil Substrates for Heat Dissipation and Mounting Area
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Solution Overview
Problem
Conventional coil substrate structures face challenges in enhancing heat dissipation and securing a mounting area while being compact, with existing designs often compromising on heat dissipation area and component mounting due to overlapping transformer coil parts and inadequate adhesion between circuit substrates and chassis.
Innovation Solution
The coil substrate structure features spirally extending conductor patterns on first and second substrates with overlapping transformer coil parts, where the substrates are shifted to increase the heat dissipation area and reduce the multilayer area, and a substrate holding structure with a through member that secures the circuit substrate to the chassis without fastening devices, allowing for enhanced adhesion and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the first and second coil substrates are disposed on each other while being superposed, then the mounting area is maximized, but the heat dissipation area is reduced
Solution Approach 1:
The patent transitions from a planar superposed arrangement to a three-dimensional offset stacked arrangement. By shifting the first and second coil substrates relative to each other in the thickness direction, the design utilizes vertical space more effectively, increasing the exposed outer surface area for heat dissipation while preserving mounting area on both substrates.
2Length of moving object
If the coil substrate structure is made smaller, then the power transmission length is reduced, but the mounting area is compromised
Solution Approach 1:
The offset stacked configuration allows the substrates to be positioned closer in the thickness direction, reducing power transmission length vertically, while the horizontal shift ensures that component mounting areas on both substrates remain fully available and do not overlap, thus preserving mounting area despite compact dimensions.
3Reliability
If fastening devices are used to secure the circuit substrate to the chassis, then the adhesion is improved, but the mounting area is reduced
Solution Approach 1:
The patent removes the need for separate fastening devices by designing the substrate holding structure to utilize the transformer coil parts themselves as the securing mechanism. The magnetic components and coil structures provide inherent mechanical engagement with the chassis, eliminating the need for additional fasteners that would occupy mounting area.
Solution Approach 2:
The transformer coil parts serve dual functions: electrical transformation and mechanical fastening. By integrating the securing function into the existing magnetic components, the design achieves multi-functionality without adding separate fastening elements, thus preserving mounting area while ensuring reliable adhesion to the chassis.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by increasing the outer surface area and reduces thermal resistance, while securing the mounting area and improving adhesion between the circuit substrate and chassis, thereby improving the overall performance and reliability of the switching power supply.
Implementation Method 1
a transformer core for magnetically connecting the primary and secondary transformer coil parts to each other
Implementation Method 2
the area where the first and second coil substrates overlap each other is reduced in the predetermined direction... elongates heat dissipation paths for mounted components
Data Source
AI summary
A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structure 100 comprises a first coil substrate 110 having a primary transformer coil part 41; a second coil substrate 120, disposed on the first coil substrate 110, having a secondary transformer coil part 42; and a transformer core 130 for magnetically connecting the transformer coil parts 41, 42 to each other. The coil substrates 110, 120 are disposed on each other while being shifted from each other such that the transformer coil parts 41, 42 overlap each other as seen in the substrate thickness direction. This can increase the heat dissipation area of the coil substrates 110, 120. The transformer coil parts 41, 42 have a width in a transmission direction A narrower than a width in a direction B intersecting the transmission direction A as seen in the substrate thickness direction. This can reduce the multilayer area of the coil substrates 110, 120 in the transmission direction A.