Offset Conductive Layers in Ceramic Heater for Temperature Uniformity
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Solution Overview
Problem
Conventional electrostatic chucks with conductive layers in ceramic substrates face separation issues due to the formation of large steps between layers, leading to potential separation between ceramic and conductive layers.
Innovation Solution
The design features conductive layers with offset outer edges and through holes, reducing the step magnitude and enhancing bonding performance between ceramic layers, while allowing for improved design freedom and two-dimensional temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple conductive layers with the same planar shape are disposed at different positions in the thickness direction, then two-dimensional temperature uniformity is improved, but large steps arise between layers causing separation between ceramic layers
Solution Approach 1:
The conductive layers are designed with different planar shapes rather than identical shapes. Specifically, the first conductive layer has a first planar shape and the second conductive layer has a second planar shape that is different from the first. This asymmetry in shape allows the outer edges to be positionally offset, reducing step magnitude and preventing ceramic layer separation while still achieving two-dimensional temperature uniformity through the distributed conductive path configuration.
Solution Approach 2:
The patent transitions from a single-layer conductive design to a multi-layer conductive design in the thickness direction. By disposing conductive layers at different positions in the thickness direction with different planar shapes, the solution utilizes the third dimension (depth) to achieve two-dimensional temperature uniformity on the surface while managing the vertical step structure through shape differentiation.
2Power
If conductive layers are disposed in the ceramic substrate, then heating function is improved, but steps between layers cause separation between conductive and ceramic layers
Solution Approach 1:
The conductive layers are designed with different planar shapes to create a stepped configuration where outer edges are positionally offset. This asymmetric design reduces the magnitude of steps between layers, minimizing the risk of separation between conductive and ceramic layers while preserving the heating function through the distributed conductive path network.
Solution Approach 2:
Different regions of the ceramic substrate receive different conductive layer configurations. The first conductive layer has a first planar shape and the second conductive layer has a second planar shape, creating localized variations in conductive path distribution. This allows optimized heating in different regions while reducing step-induced separation risks through shape differentiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes separation between ceramic and conductive layers, enhances bonding, and achieves two-dimensional temperature uniformity on the ceramic substrate, improving the reliability and performance of the heating member.
Implementation Method 1
a resistance heat-generating element (11) embedded in the ceramic substrate (13)
Implementation Method 2
By use of electrostatic attraction generated through application of voltage to the chucking electrodes, the electrostatic chuck chucks the semiconductor wafer
Data Source
AI summary
A heating member includes a ceramic substrate having a structure in which a plurality of ceramic layers are laminated together; a resistance heat-generating element embedded in the ceramic substrate; an electricity supply element disposed on a surface of the ceramic substrate; and an electricity supply path embedded in the ceramic substrate and electrically connecting the resistance heat-generating element and the electricity supply element. The electricity supply path includes a plurality of conductive layers disposed along the planar direction of the ceramic layers at different positions in the thickness direction of the ceramic substrate, and a plurality of vias disposed along the thickness direction of the ceramic substrate. When the plurality of conductive layers are viewed from the thickness direction, their outer edges are positionally offset from one another.