Offset Core Pad Bonding for High-Density Package Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional package substrates with build-up circuit structures struggle to support high-density wiring schemes required for advanced semiconductor packages, failing to meet the demands of miniaturization and integration while maintaining a simple manufacturing process.
Innovation Solution
A package substrate with a redistribution structure and a core, where the core pad is directly bonded to the bonding pad without foreign materials, and offset to reduce dimensional tolerance, enabling high-density interconnection and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional build-up circuit structures are used, then manufacturing process is simple, but high-density wiring capability is insufficient
Solution Approach 1:
The package substrate is divided into a core substrate and a redistribution structure that can be manufactured separately and then bonded together. This segmentation allows the redistribution structure to be optimized for high-density wiring while the core substrate maintains manufacturing simplicity, thereby achieving high wiring density without excessive overall complexity.
Solution Approach 2:
The invention uses a composite structure combining the core substrate and the redistribution structure made from potentially different materials optimized for their specific functions. The redistribution structure can use materials with higher Young's modulus for mechanical stability while supporting high-density interconnections, resolving the contradiction between wiring density and structural complexity.
2Reliability
If core pad and bonding pad are aligned precisely, then electrical connection is optimal, but manufacturing tolerance requirements are excessive
Solution Approach 1:
The redistribution structure is designed with pre-positioned bonding pads that are offset from the core pads. This preliminary positioning arrangement ensures that even with normal manufacturing tolerances, the bonding pads will still achieve adequate electrical connection without requiring excessive alignment precision, thereby maintaining reliability while reducing manufacturing difficulty.
Solution Approach 2:
The redistribution structure acts as an intermediary between the core substrate and the semiconductor chip. The bonding pads on the redistribution structure are deliberately offset from the core pads to provide a tolerance buffer, mediating the connection requirements and reducing the precision demands on the bonding process while maintaining electrical connection quality.
3Reliability
If foreign materials such as solders are used for bonding, then connection is facilitated, but signal transmission quality deteriorates
Solution Approach 1:
The invention extracts and eliminates foreign materials such as solders from the bonding interface between the core pad and bonding pad. By achieving direct bonding between the pads, the design removes the intermediate solder layer that degrades signal transmission quality, while the offset configuration and redistribution structure maintain ease of manufacture by reducing alignment precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves robust electrical signal transmission with low warpage and good mechanical stability, reducing manufacturing costs and efforts by eliminating the need for precise alignment and using materials with higher Young's modulus for reinforcement.
Implementation Method 1
the first core pad disposed on the first core surface and directly bonded to the bonding pad
Data Source
AI summary
A package substrate including a redistribution structure and a core is provided. The redistribution structure has a first redistribution surface and a bonding pad disposed on the first redistribution surface. The core is disposed on the redistribution structure and has a first core surface facing towards the first redistribution surface of the redistribution structure. The core has a first core pad disposed on the first core surface and directly bonded to the bonding pad, and the first core pad is offset from the bonding pad. A package structure is also provided.