Offset Drive Interface for Low-Vibration Polishing Pads
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Solution Overview
Problem
Existing grinding and/or polishing pad devices for machines are bulky, lack rigidity, and generate excessive vibration, leading to suboptimal user experience and performance.
Innovation Solution
A drive interface unit with an offset shape, designed like a sprocket, is integrated into the carrier unit, providing a space-saving, rigid, and low-vibration grinding and/or polishing pad device with improved guide properties and enhanced dust extraction capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional drive interface unit is used, then the grinding and/or polishing pad can be connected to the machine, but the device becomes bulky and lacks rigidity
Solution Approach 1:
The drive interface unit is merged with the carrier unit to form a single integral component. This integration eliminates the need for separate drive interface units, reducing overall device volume while maintaining structural rigidity through the unified design of the carrier unit and drive interface features.
Solution Approach 2:
The drive interface unit features an offset shape with asymmetric geometry that optimizes the distribution of material and structural elements. This asymmetric design allows for a compact form factor while maintaining the necessary rigidity and mechanical strength for effective drive connection.
2Object-generated harmful factors
If a conventional drive interface unit is used, then the grinding and/or polishing pad can be connected to the machine, but excessive vibration occurs
Solution Approach 1:
By integrating the drive interface unit with the carrier unit, the patent creates a unified structural assembly that reduces relative movement and vibration at the connection interface. The integral construction ensures stable force transmission and minimizes harmful vibrations during operation.
Solution Approach 2:
The offset asymmetric geometry of the drive interface unit is designed to optimize vibration damping and reduce harmful oscillations. The asymmetric shape distributes mechanical stresses more effectively, enhancing connection stability while minimizing vibration transmission to the grinding and/or polishing pad.
3Object-generated harmful factors
If the drive interface unit is made more rigid, then vibration is reduced, but the device complexity increases
Solution Approach 1:
The patent reduces device complexity by merging the drive interface unit with the carrier unit into a single integral component. This integration eliminates the need for separate rigid reinforcement elements, achieving vibration reduction through the inherent rigidity of the unified structure rather than through additional complex reinforcement.
Data Source
AI summary
A grinding and/or polishing pad device for a grinding and/or polishing pad for a grinding and/or polishing machine has a drive interface unit for connecting a carrier unit of the grinding and/or polishing pad to the grinding and/or polishing machine. The drive interface unit has an offset shape and/or the drive interface unit is designed like a sprocket.