Offset Edge Connector for High-Frequency Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-density and miniaturized electronic connectors face challenges in high-speed signal transmission due to issues like impedance, cross-talk, propagation delay, attenuation, skew, and rise time degradation, especially at frequencies above 2.0 GHz, where conventional designs struggle to maintain desired electrical characteristics.
Innovation Solution
A high-density edge connector with offset terminal portions and a staggered diamond check arrangement, utilizing a press-fit structure with elastic interference fit and a housing made of insulative material to reduce signal interference and enhance connection reliability, while maintaining symmetry in signal transmission paths for differential mode signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the distance between conductors is greatly reduced to increase pin density, then the quantity of pins increases, but signal transmission quality deteriorates due to cross-talk, impedance, and propagation delay
Solution Approach 1:
The patent applies asymmetry by offsetting the terminal portions of adjacent conductors from each other in the longitudinal direction. This asymmetric arrangement breaks the traditional aligned configuration, increasing the effective distance between conductor terminals and reducing electromagnetic coupling. The offset distance is specifically designed to be between 0.05-0.15 times the conductor width, optimizing the balance between pin density and signal quality.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement where conductors are merely side-by-side to a three-dimensional offset configuration. By introducing longitudinal offset in addition to lateral spacing, the conductors are distributed in both transverse and longitudinal dimensions, creating a staggered diamond-check pattern that reduces cross-talk while maintaining high pin density.
2Ease of manufacture
If conventional aligned conductor arrangement is used, then manufacturing is simple, but far-end cross-talk increases and signal integrity deteriorates at high frequencies
Solution Approach 1:
The patent applies asymmetry by offsetting the terminal portions of adjacent conductors from each other in the longitudinal direction. This asymmetric arrangement breaks the traditional aligned configuration, increasing the effective distance between conductor terminals and reducing electromagnetic coupling. The offset distance is specifically designed to be between 0.05-0.15 times the conductor width, optimizing the balance between pin density and signal quality.
3Ease of operation
If conductor terminals are aligned in the longitudinal direction, then assembly is straightforward, but insertion loss increases and electrical characteristics deteriorate
Solution Approach 1:
The patent applies asymmetry by offsetting the terminal portions of adjacent conductors from each other in the longitudinal direction. This asymmetric arrangement breaks the traditional aligned configuration, increasing the effective distance between conductor terminals and reducing electromagnetic coupling. The offset distance is specifically designed to be between 0.05-0.15 times the conductor width, optimizing the balance between pin density and signal quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connector achieves improved electrical characteristics with reduced far-end cross-talk and lower insertion loss, maintaining signal integrity up to 3.5 GHz, outperforming conventional connectors in high-speed environments.
Implementation Method 1
an elastic interference fit structure is utilized to retain the conductor in the housing
Implementation Method 2
a housing made of insulative material to reduce signal interference
Data Source
AI summary
An edge connector for transmitting signals at a high frequency, for example in a system environment with a frequency higher than 2.0 GHz or 3.0 GHz, is provided. The connector includes a housing and at least a first and a second conductors disposed in the housing. Each conductor has a contact portion and a terminal portion, and each contact portion form a contact surface. The at least first and second conductors are disposed in the housing in such a manner that, both the contact surfaces face a first direction, the terminal portion of the first conductor is offset from the contact portion of the first conductor along the first direction, and the terminal portion of the second conductor is offset from the contact portion of the second conductor along a second direction which is opposite to the first direction.