Offset Electrodes in MEMS Interdigitated Capacitors

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Solution Overview

Problem

MEMS devices with non-linear relationships between capacitance and deflection distance or rotation angle result in vanishing signals for small deflections and reduced distinguishability for large deflections, leading to inaccurate sensor readings due to non-uniform stress and potential sensor drift.

Innovation Solution

A silicon-on-nothing process is used to form cavities in a monocrystalline silicon substrate, creating an electrically insulated region that offsets electrodes, resulting in a linear relationship between capacitance and deflection, and reducing sensor drift by ensuring uniform stress across the device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If electrodes are arranged in a conventional interdigitated configuration without offset, then the structure is simple and easy to manufacture, but the capacitance-deflection relationship becomes non-linear causing vanishing signals for small deflections

Engineering Contradiction:
Improvesensor reading accuracyVSAvoidelectrode structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces an offset between the first and second electrodes in the interdigitated configuration, creating an asymmetric structure. This asymmetry modifies the capacitance-deflection relationship from non-linear to linear, eliminating vanishing signals for small deflections while maintaining manufacturability through standard fabrication processes.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The offset is introduced at specific locations within the electrode structure, creating localized differences in electrode positioning. This local modification produces the desired linear capacitance response without requiring complete redesign of the entire electrode array, thus balancing precision improvement with manufacturing simplicity.

Inventive Principle:
Principle #3Local quality

2Reliability

If conventional electrode configuration is used, then manufacturing process is simple, but non-uniform stress distribution causes sensor drift over time

Engineering Contradiction:
Improvesensor stabilityVSAvoidfabrication complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The asymmetric offset configuration between electrodes creates a more uniform stress distribution across the sensor structure. This asymmetric design compensates for non-uniform stress effects that cause drift, thereby improving sensor stability and reliability while using standard manufacturing techniques.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent modifies the geometric parameters of the electrode structure by introducing an offset, which changes the stress distribution characteristics. This parameter modification leads to more uniform stress fields, reducing sensor drift and improving long-term reliability without significantly complicating the fabrication process.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If offset is introduced in electrode configuration, then linear capacitance response is achieved improving sensor accuracy, but device structure becomes more complex

Engineering Contradiction:
Improvecapacitance measurement accuracyVSAvoidelectrode geometry complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

A simple asymmetric offset is introduced in the electrode configuration, which dramatically improves the linearity of the capacitance-deflection relationship. This minimal structural change achieves linear response for accurate measurements without requiring complex multi-dimensional geometries or additional components.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The electrode structure is segmented into first and second electrodes with a defined offset between them. This segmentation allows for independent optimization of each electrode's position to achieve the desired linear capacitance response, simplifying the overall design compared to fully integrated complex geometries.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10843915B2Forming an offset in an interdigitated capacitor of a microelectromechanical systems (MEMS) device
Publication Date: 2020.11.24 INFINEON TECH DRESDEN GMBH & CO KG
  • US10843915B2 patent drawing
  • US10843915B2 patent drawing
  • US10843915B2 patent drawing

AI summary

A method for forming a MEMS device may include performing a silicon-on-nothing process to form a cavity in a monocrystalline silicon substrate at a first depth relative to a top surface of the monocrystalline silicon substrate; forming, in an electrically conductive electrode region of the monocrystalline silicon substrate, an electrically insulated region extending to a second depth that is less than the first depth relative to the top surface of the monocrystalline silicon substrate; and etching the monocrystalline silicon substrate to expose a gap between a first electrode and a second electrode, wherein the second electrode is separated from the first electrode, within a first depth region, by a first distance defined by the electrically insulated region and the gap, and wherein the second electrode is separated from the first electrode, within a second depth region, by a second distance defined by the gap.