Offset Face-to-Face Semiconductor Die Stacking for Inductive Coupling
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Solution Overview
Problem
Existing semiconductor devices with face-to-back die arrangements for wireless communication face challenges in maintaining sufficient data transmission while minimizing die thickness, leading to increased costs and manufacturing issues due to the need for larger coils and fragile dies.
Innovation Solution
A face-to-face arrangement of semiconductor dies with inductors, where the first die is mounted to a substrate and the second die is mounted over the first die in an offset position, allowing for inductive coupling between coils without the thickness limitations of traditional methods, reducing coil size and material costs, and enhancing die strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If dies are thinned to decrease distance between coils for wireless communication, then data transmission efficiency is improved, but die strength decreases and manufacturing yield decreases
Solution Approach 1:
The patent transitions from a face-to-back die arrangement to a face-to-face arrangement, changing the spatial dimension of coil proximity. This allows coils to be positioned closer laterally without requiring die thinning, thereby maintaining die strength while enabling efficient wireless communication through inductive coupling between adjacent dies.
2Length of stationary object
If die thickness is decreased to improve wireless communication, then coil distance is reduced, but die fragility increases
Solution Approach 1:
Instead of reducing die thickness (one-dimensional approach), the patent uses a face-to-face arrangement that achieves coil proximity through lateral positioning and offset mounting. This multi-dimensional approach reduces coil distance without compromising die structural integrity or increasing fragility.
3Reliability
If coil size is increased to compensate for die thickness and ensure sufficient data transmission, then data transmission reliability is improved, but device area increases and cost increases
Solution Approach 1:
The face-to-face arrangement with offset positioning enables coils to be positioned in closer proximity laterally, achieving sufficient inductive coupling without requiring large coil areas. This reduces the device footprint and material costs while maintaining data transmission reliability through optimized spatial configuration rather than increased coil size.
4Reliability
If coil size is increased to ensure sufficient data transmission through thicker dies, then data transmission effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
By transitioning to a face-to-face die arrangement with offset mounting, the patent achieves effective wireless communication without requiring thick dies or large coils. This reduces material usage and manufacturing complexity, thereby lowering production costs while maintaining data transmission effectiveness through optimized inductive coupling geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient wireless communication between dies without the thickness-related issues of traditional methods, reducing material costs, manufacturing time, and die fragility, while allowing for smaller coil sizes and improved die durability.
Implementation Method 1
facilitate wireless communication between circuit elements in different dies, coils can be provided on the dies, such that adjacent dies in a multi-die stack can have proximate coils that communicate wirelessly
Data Source
AI summary
Semiconductor devices, systems including semiconductor devices, and methods of making and operating semiconductor devices. Such semiconductor devices can comprise a substrate, a first die mounted to the substrate, and a second die mounted to the first die in an offset position. The first die having first inductors at a first active side of the first die, the second inductors at a second active side of the second die, and a least one first inductor is proximate and inductively coupled to a second inductor. First interconnects electrically couple the substrate to the first die, and second interconnects electrically couple the second die to the substrate. The first interconnects extend from an upper surface of the substrate to the first active side, and the second interconnects extend from the second active side to the lower surface of the substrate.