Offset Flexible Wiring Substrates Prevent Interference in Display Modules
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Solution Overview
Problem
In display modules with integrated flexible substrates, projections on one substrate can interfere with another, causing electrical connection failures between the substrates.
Innovation Solution
The display module design includes first and second flexible wiring substrates that are offset and non-overlapping, with the first circuit substrate having a display area and a peripheral area, and the second circuit substrate having an additional function area, where the flexible wiring substrates are joined to the edges of the respective peripheral areas, and are curved to extend away from each other, preventing overlap and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flexible wiring substrates are joined to edges of circuit substrates that are disposed on top of each other, then electrical connection between substrates is achieved, but projections on one substrate may interfere with another substrate causing connection failure
Solution Approach 1:
The patent offsets the first and second edges in the planar direction so that the first and second flexible wiring substrates are disposed at different positions and do not overlap with each other. This dimensional arrangement in the planar direction eliminates mutual interference while maintaining electrical connection reliability.
Solution Approach 2:
The patent employs asymmetric arrangement where the first circuit substrate and second circuit substrate are positioned at different heights (superposed but not aligned), and their peripheral edges are offset from each other. This asymmetric configuration prevents projections on one substrate from interfering with another substrate.
2Device complexity
If multiple flexible substrates are integrated in a compact arrangement, then device integration is improved, but the frame size may be reduced while substrate interference risk increases
Solution Approach 1:
The patent utilizes vertical stacking (superposition) of circuit substrates to achieve compact integration, while simultaneously offsetting peripheral edges in the planar direction to prevent interference. This multi-dimensional arrangement enables high integration without increasing frame size or causing substrate interference.
Solution Approach 2:
The patent integrates multiple flexible substrates in a nested configuration where the first and second circuit substrates are superposed, and their peripheral areas are arranged in an offset manner. This nesting approach achieves compact integration while maintaining clear separation between substrates.
Data Source
AI summary
A display module includes an image display panel, a touch screen, a first FPC substrate, and a second FPC substrate. The first and second FPC substrates are disposed so as not to overlap with each other. The image display panel has a first curved portion in its first peripheral area. The touch screen has a second curved portion in its second peripheral area. The first and second FPC substrates each extend toward the opposite side of the image display panel from the touch screen.