Offset Ground Via Arrangement for PDN Channel Width
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Solution Overview
Problem
Conventional circuit board designs result in narrow power delivery network (PDN) channels due to the placement of ground vias, leading to increased inductance and resistance, which degrades power routing efficiency.
Innovation Solution
The arrangement of ground vias is offset from the axis of signal and ground connection terminals, allowing for a wider PDN channel trace by reducing the width of the ground via arrangement, thereby improving power routing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground vias are placed directly below ground connection terminals on the same axis, then ground connection stability is improved, but PDN channel width is reduced leading to increased inductance and resistance
Solution Approach 1:
The patent applies asymmetry by offsetting the ground via from the vertical axis of the ground connection terminal. Instead of placing the via directly below the terminal (symmetric alignment), the via is positioned at an offset distance, creating an asymmetric arrangement that widens the PDN channel while maintaining adequate ground connection through the via to ground plane interface
2Loss of energy
If ground vias are offset from the axis of connection terminals, then PDN channel width is increased reducing inductance and resistance, but ground via alignment with terminals is reduced
Solution Approach 1:
The patent applies local quality by creating different spatial zones with different functional requirements. The ground via is positioned in a local region offset from the terminal axis, allowing the PDN channel to occupy the central region with maximum width while the ground via occupies the offset position to provide localized ground connection without constraining the power routing path
Data Source
AI summary
Certain aspects of the present disclosure generally relate to a circuit board with ground vias offset from associated ground bumps. One example circuit board generally includes a first signal connection terminal configured to connect a signal line of the circuit board to an integrated circuit (IC); a ground plane having a first ground connection terminal disposed adjacent to the first signal connection terminal, the first ground connection terminal being configured to provide a ground connection between the ground plane and the IC; and a first ground via associated with and disposed adjacent to the first ground connection terminal and coupled to the ground plane, wherein, from an overhead view of the circuit board, the first ground via is located at a position that is offset from a first axis on which the first signal connection terminal and the first ground connection terminal are disposed.