Offset Hall Sensor Contacts for Perpendicular Field Measurement
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Solution Overview
Problem
Lateral Hall effect sensors integrated in semiconductor substrates are highly sensitive to mechanical stresses, leading to sensitivity drift and offset issues due to the soldering process and environmental influences, making it difficult to maintain accurate magnetic field measurements.
Innovation Solution
The Hall effect sensor incorporates modified vertical Hall elements with electrical contacts arranged in a straight line on the substrate surface, offset relative to the axis of symmetry, enabling sensitivity to both parallel and perpendicular magnetic field components, which can be compensated through circuitry and signal evaluation, reducing mechanical stress sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If lateral Hall effect sensors are used to measure magnetic field components perpendicularly to the substrate surface, then measurement capability is achieved, but sensitivity drift and offset occur due to mechanical stresses from soldering and environmental influences
Solution Approach 1:
The patent applies asymmetry by offsetting the electrical contacts from the axis of symmetry of the semiconductor region. This asymmetric arrangement creates sensitivity to both parallel and perpendicular magnetic field components, enabling the sensor to measure perpendicular components while the asymmetric geometry inherently reduces sensitivity to mechanical stresses compared to traditional lateral sensors.
Solution Approach 2:
The patent transitions from traditional lateral Hall effect sensors that only measure in-plane magnetic fields to a configuration that measures magnetic field components in three dimensions. By arranging contacts asymmetrically on the end face, the sensor gains sensitivity to the perpendicular magnetic field component (normal to the substrate surface), adding a new measurement dimension.
2Ease of manufacture
If electrical contacts are arranged on the side edges of the end face (traditional lateral Hall sensor), then manufacturing is simplified, but the sensor becomes highly sensitive to mechanical stresses causing offset and sensitivity drift
Solution Approach 1:
The patent modifies the traditional symmetric contact arrangement by offsetting the electrical contacts from the axis of symmetry. This asymmetric positioning reduces the sensor's sensitivity to mechanical stresses while maintaining ease of manufacture through standard photolithography processes. The asymmetric geometry inherently compensates for stress-induced variations.
Solution Approach 2:
The patent applies local quality by creating regions with different contact positions relative to the axis of symmetry. The offset contact arrangement creates specific local geometric properties that reduce stress sensitivity in critical areas while maintaining overall manufacturing simplicity through standard fabrication processes.
3Measurement precision
If re-calibration is performed after soldering to compensate for mechanical stress influence, then measurement accuracy is restored, but subsequent operation still suffers from sensitivity drift due to temperature and moisture
Solution Approach 1:
The patent implements preliminary action by designing the contact arrangement to be inherently less sensitive to mechanical stresses before the soldering process occurs. The offset contact geometry pre-compensates for stress effects, reducing the need for post-soldering calibration and improving long-term stability against temperature and moisture variations during operation.
Solution Approach 2:
The patent converts the harmful effect of mechanical stresses into a benefit by using the asymmetric contact arrangement to inherently compensate for stress-induced variations. The offset geometry transforms stress effects that would normally cause drift into a stable measurement characteristic, improving long-term reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for stress-resistant measurements of magnetic field components perpendicular to the substrate surface, improving temperature synchronization and enabling accurate detection of both parallel and perpendicular field components, thus overcoming the limitations of traditional lateral Hall effect sensors.
Implementation Method 1
Hall effect sensor which is integrated in a semiconductor substrate and enables measurement of a magnetic field component perpendicularly to the surface of the semiconductor substrate
Implementation Method 2
These stresses cause an offset and sensitivity drift due to piezoresistive effects and the piezo-Hall effect
Implementation Method 3
These stresses cause an offset and sensitivity drift due to piezoresistive effects and the piezo-Hall effect
Data Source
AI summary
The present invention relates to a Hall effect sensor which is integrated in a semiconductor substrate and enables measurement of a magnetic field component. perpendicularly to the surface of the semiconductor substrate. The Hall effect sensor comprises several Hall elements having an electrically conductive semiconductor region which has a straight-line row of electrical measuring and control contacts on an end face on the substrate surface. The Hall elements are designed or can be operated in such manner that they have a sensitivity both to a magnetic field component parallel to and the magnetic field component perpendicular to the substrate surface of the semiconductor substrate (1). Several of the Hall elements are arranged such that their sensitivity to a magnetic field component parallel to the substrate surface of the semiconductor substrate can be compensated mutually by circuitry or in a signal evaluation. In this way, a sensitivity of these Hall elements to the magnetic field component perpendicular to the substrate surface of the semiconductor substrate is obtained. By using these Hall elements for measuring the magnetic field component perpendicularly to the substrate surface, a very low sensitivity to mechanical stresses can be achieved.