Offset Heat Sink Layout for Compact Electronic Cooling
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Solution Overview
Problem
Existing thermal regulation devices face challenges in balancing thermal performance, weight, and cost due to limitations in manufacturing methods, with extrusion producing thin but simple shapes and injection molding resulting in heavy and expensive parts with less thermal efficiency.
Innovation Solution
A thermal regulation device comprising a plate with offset and differently shaped heat sinks that promote airflow turbulence, allowing for separate manufacturing and assembly, enhancing heat exchange while maintaining a compact size and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If extrusion manufacturing is used for thermal regulation devices, then thermal performance and weight are improved, but shape complexity is limited
Solution Approach 1:
The thermal regulation device is divided into multiple heat sinks with different shapes and functions, allowing each segment to be optimized for specific thermal management tasks while maintaining overall system performance
Solution Approach 2:
Different regions of the thermal regulation device have different heat sink configurations tailored to local thermal requirements, with varying shapes, sizes, and airflow characteristics matched to specific heat generation zones
2Device complexity
If injection molding is used for thermal regulation devices, then shape complexity is improved, but weight and thermal performance deteriorate
Solution Approach 1:
The device combines multiple heat sink types and materials to achieve both complex shapes and good thermal performance, using aluminum extrusion for high thermal conductivity components while incorporating injection-molded parts for structural complexity
3Temperature
If heat sink dimensions are increased to compensate for poor thermal performance, then thermal performance is improved, but weight and manufacturing cost increase
Solution Approach 1:
The invention optimizes thermal performance by changing geometric parameters of heat sinks including offset distances, opening positions, and fin configurations rather than simply increasing overall dimensions, achieving better heat dissipation with compact size
4Adaptability or versatility
If heat sinks are manufactured separately and assembled later, then placement flexibility is improved, but device complexity increases
Solution Approach 1:
Heat sinks are manufactured as separate modular components that can be independently optimized and then assembled onto the circuit board, allowing flexible placement strategies to match thermal requirements with component locations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves effective heat dissipation with improved thermal performance, reduced weight, and lower production costs by optimizing airflow turbulence and allowing for flexible heat sink placement on circuit boards.
Implementation Method 1
the airflow (natural or forced) circulating within the invention encounters obstacles (the heat sinks) that disrupt the airflow by dividing it and/or changing its direction. This promotes heat exchange between the heat sinks and the airflow.
Data Source
Figure 1
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AI summary
Thermal regulation device comprising at least: - A plate (2), - At least two heat sinks (4) mounted on the plate, each heat sink comprising at least one opening through which an airflow is intended to circulate, the two heat sinks being mounted on the plate so that their openings are offset from each other and/or so that at least one wall forming at least one of the openings is aligned with the other opening. Associated electronic equipment.