Offset Layer Stacking for Thin-Walled Package Stability
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Solution Overview
Problem
Un-stackable and thin-walled packages require significant space for transportation and may deform when randomly packed, leading to issues with lid fitting and increased costs due to the need for interlayers, especially in hygienic applications.
Innovation Solution
A method for forming a stack of thin-walled packages by arranging layers with offset configurations to maximize space efficiency without interlayers, using a side-by-side configuration with each layer offset in the x or y direction relative to the previous layer, allowing for even distribution of displacement directions to prevent deformation and tilting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If packages are randomly tossed into transportation cases, then space utilization is improved, but package wall deformation occurs
Solution Approach 1:
The patent divides the transportation case into multiple layers with packages arranged in specific patterns. Each layer is segmented from others by offset configurations, preventing direct vertical contact and wall deformation while maintaining compact space utilization through systematic layering.
Solution Approach 2:
The patent employs asymmetric offset arrangements where successive layers are positioned at different horizontal locations relative to each other. This asymmetric configuration ensures that packages in one layer do not directly align with packages below, distributing mechanical stresses and preventing wall deformation during transport.
2Reliability
If packages are piled on top of each other in layers, then package wall deformation is prevented, but transportation space is consumed
Solution Approach 1:
The patent transitions from simple vertical stacking to a multi-dimensional arrangement where layers are offset in horizontal dimensions. This dimensional change allows packages to be arranged more compactly by utilizing both vertical and horizontal positioning, reducing the overall transportation volume while maintaining layer-based protection against deformation.
Solution Approach 2:
The offset layer arrangement creates a nested configuration where packages in upper layers are positioned to nest within the spatial envelope formed by lower layers. This nesting effect maximizes space utilization by ensuring that the combined volume of multiple layers fits efficiently within the transportation case without requiring excessive empty space.
3Stability of the object's composition
If interlayers are placed between packages, then package tilting is prevented, but cost increases
Solution Approach 1:
The patent employs a self-service approach where the package structure itself provides stability through its offset arrangement. The geometric configuration of layers naturally prevents tilting and falling without requiring additional interlayer materials. Each layer's offset position creates inherent structural support, eliminating the need for extra stabilizing components and reducing manufacturing costs.
4Ease of manufacture
If interlayers are reused, then cost is reduced, but hygienic requirements are compromised
Solution Approach 1:
The patent extracts the need for interlayers entirely from the packaging system by using the offset layer arrangement itself to provide stability. This extraction eliminates the hygienic issues associated with reusing or cleaning interlayers, as no separate stabilizing materials are required. The solution achieves both cost reduction and hygienic compliance by removing the problematic component from the system.
Data Source
Figure 1A~1B
Figure 2~3
Figure 4A~4B
AI summary
The present application relates to a method for forming a stack of thin-walled packages, wherein all of said thin-walled packages in the stack are of the same shape and size, and each thin-walled package has a lower surface with a length (I x ) extending in an x-direction and a length (I y ) extending in a y-direction of an x-y plane. The stack comprises two or more distinct layers of thin-walled packages, wherein each layer is of the same size with a horizontal extension in the x-direction and in the y-direction of an x-y plane and a vertical extension in a z-direction perpendicular to the x-y plane. The method comprises the steps of: a) arranging a layer of three or more packages in a side-by-side configuration with said lower surfaces of said packages in a plane parallel to the x-y plane, b) arranging a subsequent layer of three or more packages on top of a previously arranged layer in a side-by-side configuration with said lower surfaces of said packages in said subsequent layer arranged in a plane parallel to the x-y plane and with said subsequent layer being offset in relation to said previous layer in the x-direction and/or in the y-direction such that the center point of the smallest rectangle that can be drawn around said subsequent layer in the x-y plane is offset a distance d x in the x-direction and/or a distance d y in the y-direction in relation to the center point of the smallest rectangle that can be drawn around said first layer in the x-y plane, c) repeating step b) one or more times wherein each subsequent layer is arranged on top of a previous layer and wherein the offset distances d x in the x-direction and/or a distance d y in the y-direction are the same for all subsequent layers and said offset direction are shifted in each repetition of step b).