Offset Mesa Superstrate for Planarization Separation

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Solution Overview

Problem

Current planarization techniques in semiconductor fabrication face defects due to separation issues between the superstrate and dispense material, hindering whole wafer processing.

Innovation Solution

A superstrate design with a body and mesa having different center points, an exclusion region, and alignment markers facilitates planarization by allowing controlled separation using the exclusion region, enabling efficient whole wafer processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a superstrate is used for planarization, then planarization quality is improved, but separation defects occur between the superstrate and dispense material

Engineering Contradiction:

Improveplanarization qualityVSAvoidseparation defects

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The superstrate is segmented into a mesa portion (contacting the substrate) and a flange portion (exclusion region). This segmentation allows the mesa to maintain intimate contact with the dispense material for high-quality planarization while the flange provides a separation zone that prevents defects by allowing controlled separation between the superstrate and substrate.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The exclusion region acts as an intermediary zone between the mesa and the substrate edge. This region facilitates controlled separation and prevents direct adhesion issues between the superstrate and dispense material at the boundaries, thereby reducing separation defects while maintaining planarization quality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If whole wafer processing is implemented, then productivity is improved, but specialized equipment for different substrate sizes is required

Engineering Contradiction:

Improvewhole wafer processingVSAvoidspecialized equipment

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The superstrate design with its mesa and flange structure is universally applicable to different substrate sizes. The same superstrate geometry can be used across various wafer diameters, eliminating the need for specialized equipment for different substrate sizes and enabling whole wafer processing with a single tool configuration.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of operation

If the mesa diameter is smaller than the body diameter, then controlled separation is enabled, but alignment precision must be maintained

Engineering Contradiction:

Improvecontrolled separationVSAvoidalignment precision

Core Design Contradiction:

Ease of operationVSMeasurement precision

Solution Approach 1:

The asymmetric geometry where the mesa diameter is smaller than the body diameter creates a non-uniform structure that enables controlled separation. The offset between the mesa center and body center further enhances this effect, allowing the superstrate to be separated in a controlled manner while maintaining alignment through the asymmetric contact zone.

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS11204549B2Superstrate with an offset mesa and methods of using the same

Publication Date: 2021.12.21 CANON KK

AI summary

An apparatus may include a superstrate. The superstrate may have a body with a first side, a second side opposite the first side, and a first diameter. The superstrate may also include a mesa on the first side of the body. The mesa may have a second diameter. The center point of the body can be different from the center point of the mesa.