Offset PCB Antenna Module for Signal Loss Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for high-frequency antennas in electronic devices poses challenges in minimizing signal transmission loss and optimizing space usage, while also requiring cost-effective and convenient manufacturing processes.
Innovation Solution
A printed circuit board design featuring a combination of rigid and flexible substrate portions, where the substrates are offset to overlap each other, allowing for the integration of antennas on one substrate portion and minimizing signal loss through dielectric constant and dissipation factor adjustments, and enabling separate manufacturing and connection for cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of antennas is increased to meet 5G high-frequency communication requirements, then signal transmission capability is improved, but space consumption increases and signal transmission loss worsens
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. Multiple antenna modules are arranged in vertical layers with substrate portions overlapping each other, effectively utilizing the Z-axis dimension. This allows multiple antennas to be integrated within a compact footprint area, increasing antenna density without proportionally increasing the device's planar dimensions.
Solution Approach 2:
The patent implements a nested structure where antenna modules are embedded within layered substrate portions. The first and second antenna modules are positioned at different vertical levels, with their respective substrate portions overlapping and nesting within the same lateral space. This nested arrangement allows compact integration of multiple antenna systems while minimizing overall space occupation.
2Adaptability or versatility
If antennas are added for high-frequency bands, then communication functionality is improved, but signal transmission loss increases due to longer transmission paths
Solution Approach 1:
By arranging antenna modules in vertical layers rather than spreading them horizontally, the patent shortens the lateral transmission distance for signals. The stacked configuration reduces the path length through lossy substrate materials compared to planar arrangements, thereby minimizing signal attenuation while supporting multiple frequency bands.
Solution Approach 2:
The patent introduces connection portions as intermediary structures that provide optimized signal pathways between antenna modules and circuit boards. These connection portions are specifically designed with controlled impedance and minimized length to reduce signal loss during transmission, acting as efficient mediators between the antenna elements and the communication circuitry.
3Area of stationary object
If integrated antenna-substrate structures are used, then space is optimized, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the antenna system into separate modular units (first antenna module, second antenna module) that can be independently manufactured and then assembled. Each module contains its own antenna element and associated substrate portion, allowing for standardized mass production of individual modules followed by modular assembly, thereby reducing overall manufacturing complexity while maintaining compact integration.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the antenna modules with their substrate portions before final assembly. The substrate portions are prepared with predetermined shapes and connection structures in advance, enabling simplified subsequent assembly processes. This preliminary preparation reduces the complexity of the final integration step while achieving the desired compact configuration.
4Volume of moving object
If substrates are closely integrated to miniaturize the product, then product size is reduced, but signal transmission loss increases
Solution Approach 1:
The patent resolves the conflict between miniaturization and signal loss by moving the integration strategy to the vertical dimension. Multiple antenna modules are stacked with overlapping substrate portions, achieving compact volume through Z-axis layering rather than compressing components in the XY plane. This maintains adequate signal transmission paths while reducing overall product footprint.
Solution Approach 2:
The connection portions serve as optimized intermediaries that bridge the gap between closely integrated antenna modules. These connection structures are designed with appropriate impedance matching and minimized parasitic effects, enabling efficient signal transmission between vertically stacked modules even when they are closely integrated, thereby preventing signal loss despite compact spacing.
Data Source
AI summary
The present disclosure relates to a printed circuit board. The printed circuit board includes: a first substrate portion having a rigid region and a flexible region; and a second substrate portion disposed on the first substrate portion. The first substrate portion and the second substrate portion are disposed to be shifted such that portions of each of the first substrate portion and the second substrate portion overlap each other.