Offset Photonics Die Stack for Compact Light Routing and Noise Control
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Solution Overview
Problem
The challenge is to integrate photonics circuits into compact electronic devices while managing size constraints, as existing photonics architectures are difficult to fit due to their size and thickness limitations, leading to noise issues in imaging systems like medical ultrasound and radar systems.
Innovation Solution
A stacked photonics system with offset vertically arranged dies, each with different functionalities, including light emitters, optical elements, and a mirror, which allows for modular configuration and efficient light emission and detection, using an aperture structure and optical elements to control light paths and reduce noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If photonics circuits are integrated into compact electronic devices, then device functionality is improved, but device size and thickness constraints are worsened
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacking, arranging multiple photonics circuits vertically in layers. This dimensional change allows multiple functional circuits to coexist within a compact footprint, effectively increasing device functionality while maintaining constrained volume through vertical rather than horizontal expansion.
Solution Approach 2:
The patent implements nested packaging where photonics circuits are stacked vertically with each circuit positioned within the vertical envelope of the device. Multiple circuits are nested in layers, with upper circuits positioned above lower circuits, allowing maximum functional integration within the device's thickness constraints.
2Area of stationary object
If multiple photonics circuits are stacked vertically, then area utilization is improved, but light path interference and noise are worsened
Solution Approach 1:
The patent assigns different functional characteristics to different vertical layers, with specific circuits designated for light emission at particular wavelengths and others for detection. This local functional differentiation ensures that light paths are spatially separated by function, preventing interference between emission and detection circuits while maximizing area utilization through vertical stacking.
Solution Approach 2:
The patent segments the vertical stack into distinct functional groups: light emitter circuits positioned in certain layers and light detector circuits in other layers. This segmentation creates functional zones that prevent light path interference, as emitted light from upper layers does not interfere with detection in lower layers and vice versa, while still achieving high area utilization.
3Ease of manufacture
If offset vertical stacking is used, then manufacturing complexity is reduced, but alignment precision requirements are worsened
Solution Approach 1:
The patent employs asymmetric offset positioning where adjacent photonics circuits are shifted horizontally relative to each other in the vertical stack, rather than being perfectly aligned. This asymmetric arrangement simplifies manufacturing by reducing the precision requirements for vertical alignment, as the offset positions are less sensitive to stacking variations, while still maintaining functional integrity through proper optical coupling design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables compact photonics assemblies that effectively manage size constraints, reduce noise, and enhance imaging quality by allowing for precise light control and detection, improving the performance of compact electronic devices.
Implementation Method 1
an optical element configured to receive and collimate the first light and the second light into collimated light
Implementation Method 2
a mirror configured to receive the collimated light from the optical element and reflect the collimated light received from the optical element
Data Source
AI summary
Configurations for a photonics assembly and the operation thereof are disclosed. The photonics assembly may include multiple photonics dies which may be arranged in an offset vertical stack. The photonics dies may emit light, and in some examples, an optical element may be a detector for monitoring properties such as the wavelength of the light. The photonics dies may be arranged in a stack as a package and the packages may be stacked or arranged side by side or both for space savings. The PIC may include combining and/or collimating optics to receive light from the photonics dies, a mirror to redirect the light, and an aperture structure. The aperture structure may include a region which is at least partially transparent such that light transmits through the transparent region of the aperture structure. The aperture structure may include an at least partially opaque region which may be used for directing and/or controlling the light launch position.